Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor
2021 ◽
Vol 131
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pp. 76-85
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1993 ◽
Vol 443
(1917)
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pp. 183-201
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2012 ◽
Vol 26
(9)
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pp. 2719-2726
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1994 ◽
Vol 45
(1)
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pp. 166-173
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1968 ◽
Vol 44
(5)
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pp. 1237-1245
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1976 ◽
Vol 27
(6)
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pp. 791-800
1970 ◽
Vol 50
(12)
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pp. 721-735
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2001 ◽
Vol 20
(6)
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pp. 997-1005
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