Effect of seat-type abutment load path and failure mode on seismic response of straight ordinary bridges

2021 ◽  
Vol 242 ◽  
pp. 112560
Author(s):  
Haider H. Darwash ◽  
Kevin R. Mackie
Keyword(s):  
Seismic Response ◽  
Failure Mode ◽  
Load Path

scholarly journals Validation of a Design Procedure for Failure Mode Control of EB-Frames: Push-Over and IDA Analyses

2013 ◽  
Vol 7 (1) ◽  
pp. 193-207 ◽  
Author(s):  
Luigi Mastrandrea ◽  
Elide Nastri ◽  
Vincenzo Piluso
Keyword(s):  
Seismic Response ◽  
Failure Mode ◽  
Design Procedure ◽  
High Energy ◽  
Collapse Mechanism ◽  
Braced Frames ◽  
Link Length ◽  
Eccentrically Braced Frames ◽  
Ductility Demand ◽  
Global Type

The paper is devoted to the investigation of the seismic response of eccentrically braced frames characterised by links having different length. In addition, the analysed structures have been designed according to a methodology, already proposed by the authors, aiming to guarantee a collapse mechanism of global type. Therefore, the results of the nonlinear analyses herein presented provide the validation of the proposed design procedure, by testifying that all the designed structures exhibit a global failure mode where all the links are yielded while all the columns remain in elastic range with the exception of the base section of first storey columns, leading to high energy dissipation capacity and global ductility. Furthermore, two different distributions of the link lengths are examined. The first one is characterised by short links with uniform lengths along the height of the structure. The second one is characterised by the use of link elements having different length at the different storeys which are selected to assure the same value of the non-dimensional link length. The seismic response of EB-Frames with such distributions of the link length is investigated by means of both push-over analyses and dynamic non-linear analyses. The comparison of the performances is mainly carried out in terms of plastic hinges distribution, local ductility demand and frame lateral stiffness.

scholarly journals Study on Performance of Floating Column with Different Configurations

2021 ◽  
pp. 749-759
Author(s):  
Gokul Kishore K S ◽  
Manju R
Keyword(s):  
Seismic Response ◽  
Spectrum Analysis ◽  
Response Spectrum ◽  
Structural Response ◽  
Lateral Stability ◽  
Load Path ◽  
Response Spectrum Analysis ◽  
Ground Floor ◽  
Earthquake Loads

Floating column is a type of columns which distributes the load to beams rather than foundation. This is common in multi storey buildings which are anticipated to accommodate parking at ground floor or open halls at higher floors. These columns have discontinuities in the load path when a column coming from top of the building is discontinued at a lower level, usually at the ground storey. The structure with floating column should be designed for earthquake loads so these buildings will be in seismic prone areas. In this study, the effect of various lateral stability techniques to the building with floating columns on various structural response quantities of the building using response spectrum analysis is studied. The main objective here is to study the seismic response of building with floating columns with various lateral stability techniques and to find out the most appropriate configuration for providing floating columns. Various parameters such as story displacement, storey drift, story shear, story stiffness of a building is studied with respect to different configurations of floating columns.

Reduced formulation for post-elastic seismic response of dual load path bridges

2013 ◽  
Vol 51 ◽  
pp. 178-187 ◽  
Author(s):  
E. Tubaldi ◽  
A. Dall’Asta ◽  
L. Dezi
Keyword(s):  
Seismic Response ◽  
Load Path

Analytical electron microscopy of grain boundaries in Al-Cu metallizations

1992 ◽  
Vol 50 (2) ◽  
pp. 1684-1685
Author(s):  
J. R. Michael ◽  
A. D. Romig ◽  
D. R. Frear
Keyword(s):  
Electron Microscopy ◽  
Integrated Circuits ◽  
Failure Mode ◽  
Current Density ◽  
Thermal History ◽  
Analytical Electron Microscopy ◽  
Cu Metallization ◽  
Analytical Electron ◽  
Interconnect Lines

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.

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