A three-dimensional numerical model for a convection–diffusion phase change process during laser melting of ceramic materials

2004 ◽  
Vol 47 (25) ◽  
pp. 5523-5539 ◽  
Author(s):  
J.F. Li ◽  
L. Li ◽  
F.H. Stott
Keyword(s):  
Numerical Model ◽  
Phase Change ◽  
Change Process ◽  
Three Dimensional ◽  
Ceramic Materials ◽  
Laser Melting ◽  
Convection Diffusion ◽  
Phase Change Process ◽  
Diffusion Phase

Experimental and numerical simulation of phase change process for paraffin in three-dimensional graphene aerogel

2020 ◽  
Vol 167 ◽  
pp. 114773 ◽  
Author(s):  
Zhicheng Feng ◽  
Yongsheng Li ◽  
Fangfang He ◽  
Yintao Li ◽  
Yuanlin Zhou ◽  
...  
Keyword(s):  
Numerical Simulation ◽  
Phase Change ◽  
Change Process ◽  
Three Dimensional ◽  
Graphene Aerogel ◽  
Phase Change Process

Ceramic-Based Planar Heat Pipe (Plate) for Passive Electronics Cooling

2011 ◽  
Vol 2011 (CICMT) ◽  
pp. 000159-000165
Author(s):  
M. Wilson ◽  
H. Anderson ◽  
J. Fellows ◽  
C. Lewinsohn
Keyword(s):  
Integrated Circuits ◽  
Phase Change ◽  
Heat Dissipation ◽  
Thermal Contact ◽  
Three Dimensional ◽  
Electronics Cooling ◽  
Ceramic Materials ◽  
Back Side ◽  
Dimensional Network ◽  
Internal Networks

Heat dissipation has become a major hurdle for the electronics industry, especially as higher performance integrated circuits are being developed for the power industry. Two of the primary hurdles in dissipating this heat are:The thermal contact resistance between the IC and the cooling device.The ability to effectively spread the heat, such that traditional cooling technologies can be effective.By selecting ceramic materials that are thermo-mechanically matched (CTE) to IC materials, the proposed heat plate can be directly bonded by typical solder or braze techniques to the back-side of the IC. This eliminates thermal resistances due to contact and thermal interface materials. Within these heat plates, a three dimensional network of gas channels and fluid wicks spread the high-flux heat loads from localized hot spots to the surrounding regions via phase change fluids and mass transport. Like traditional heat pipes, these heat plates operate at nearly uniform temperature due to the phase change. The internal networks provide for multidimensional heat and mass flow, increasing their dissipating capability. By using matched ceramic materials, and the inclusion of a heat plate, these primary hurdles for heat dissipation can be mitigated. The performance of prototypical planar heat plates will be presented.

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