A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.

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Two-phase flow in high-heat-flux micro-channel heat sink for refrigeration cooling applications: Part I––pressure drop characteristics

International Journal of Heat and Mass Transfer ◽

10.1016/j.ijheatmasstransfer.2004.09.018 ◽

2005 ◽

Vol 48 (5) ◽

pp. 928-940 ◽

Cited By ~ 193

Author(s):

Jaeseon Lee ◽

Issam Mudawar

Keyword(s):

Heat Flux ◽

Pressure Drop ◽

Heat Sink ◽

Two Phase Flow ◽

High Heat ◽

High Heat Flux ◽

Phase Flow ◽

Micro Channel ◽

Two Phase

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Pumping power and heating area dependence of thermal resistance for a large-scale microchannel heat sink under extremely high heat flux

Heat and Mass Transfer ◽

10.1007/s00231-021-03104-y ◽

2021 ◽

Author(s):

Bo Sun ◽

Huiru Wang ◽

Zhongshan Shi ◽

Ji Li

Keyword(s):

Heat Flux ◽

Thermal Resistance ◽

Heat Sink ◽

Large Scale ◽

High Heat ◽

High Heat Flux ◽

Microchannel Heat Sink ◽

Pumping Power

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Model Predictive Control of a Pumped Two-Phase Cooling System With Microchannel Heat Exchangers

Volume 2: Control and Optimization of Connected and Automated Ground Vehicles; Dynamic Systems and Control Education; Dynamics and Control of Renewable Energy Systems; Energy Harvesting; Energy Systems; Estimation and Identification; Intelligent Transportation and Vehicles; Manufacturing; Mechatronics; Modeling and Control of IC Engines and Aftertreatment Systems; Modeling and Control of IC Engines and Powertrain Systems; Modeling and Management of Power Systems ◽

10.1115/dscc2018-9143 ◽

2018 ◽

Author(s):

Oyuna Angatkina ◽

Andrew Alleyne

Keyword(s):

Heat Flux ◽

Model Predictive Control ◽

Predictive Control ◽

Heat Exchangers ◽

Cooling System ◽

High Heat ◽

High Heat Flux ◽

Two Phase ◽

Cooling Systems ◽

Two Phase Cooling

Two-phase cooling systems provide a viable technology for high–heat flux rejection in electronic systems. They provide high cooling capacity and uniform surface temperature. However, a major restriction of their application is the critical heat flux condition (CHF). This work presents model predictive control (MPC) design for CHF avoidance in two-phase pump driven cooling systems. The system under study includes multiple microchannel heat exchangers in series. The MPC controller performance is compared to the performance of a baseline PI controller. Simulation results show that while both controllers are able to maintain the two-phase cooling system below CHF, MPC has significant reduction in power consumption compared to the baseline controller.

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06/00796 Two-phase flow in high-heat-flux micro-channel heat sink for refrigeration cooling applications: Part II — heat transfer characteristics

Fuel and Energy Abstracts ◽

10.1016/s0140-6701(06)80798-8 ◽

2006 ◽

Vol 47 (2) ◽

pp. 118

Keyword(s):

Heat Transfer ◽

Heat Flux ◽

Heat Sink ◽

Two Phase Flow ◽

High Heat ◽

High Heat Flux ◽

Phase Flow ◽

Micro Channel ◽

Heat Transfer Characteristics ◽

Two Phase

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Numerical Investigation of Flow Boiling in a Manifold Microchannel Heat Sink With Conjugate Heat Transfer

ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer ◽

10.1115/mnhmt2019-4042 ◽

2019 ◽

Author(s):

Zhichuan Sun ◽

Yang Luo ◽

Junye Li ◽

Wei Li ◽

Jingzhi Zhang ◽

...

Keyword(s):

Heat Transfer ◽

Numerical Investigation ◽

Heat Sink ◽

Conjugate Heat Transfer ◽

Flow Boiling ◽

High Heat Flux ◽

Microchannel Heat Sink ◽

Two Phase ◽

Boiling Process ◽

Manifold Microchannel

Abstract The manifold microchannel heat sink receives an increasing number of attention lately due to its high heat flux dissipation. Numerical investigation of boiling phenomena in manifold microchannel (MMC) heat sinks remains a challenge due to the complexity of fluid route and the limitation of numerical accuracy. In this study, a computational fluid dynamics (CFD) approach including subcooled two-phase flow boiling process and conjugate heat transfer effect is performed using a MMC unit cell model. Different from steady-state single phase prediction in MMC heat sink, this type of modeling allows for the transient simulation for two-phase interface evolution during the boiling process. A validation case is conducted to validate the heat transfer phenomenon among three phases. Besides, this model is used for the assessment of the manifold dimensions in terms of inlet and outlet widths at the mass flux of 1300 kg/m2·s. With different ratios of inlet-to-outlet area, the thermal resistances remain nearly stable.

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