Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages

2019 ◽  
Vol 163 ◽  
pp. 114338 ◽  
Author(s):  
Fengze Hou ◽  
Wenbo Wang ◽  
Hengyun Zhang ◽  
Cheng Chen ◽  
Chuan Chen ◽  
...  
Author(s):  
Oyuna Angatkina ◽  
Andrew Alleyne

Two-phase cooling systems provide a viable technology for high–heat flux rejection in electronic systems. They provide high cooling capacity and uniform surface temperature. However, a major restriction of their application is the critical heat flux condition (CHF). This work presents model predictive control (MPC) design for CHF avoidance in two-phase pump driven cooling systems. The system under study includes multiple microchannel heat exchangers in series. The MPC controller performance is compared to the performance of a baseline PI controller. Simulation results show that while both controllers are able to maintain the two-phase cooling system below CHF, MPC has significant reduction in power consumption compared to the baseline controller.


2008 ◽  
Vol 31 (3) ◽  
pp. 691-701 ◽  
Author(s):  
B. Agostini ◽  
J.R. Thome ◽  
M. Fabbri ◽  
B. Michel

2015 ◽  
Vol 3 (4) ◽  
pp. 369-391 ◽  
Author(s):  
Nicolas Lamaison ◽  
Jackson Braz Marcinichen ◽  
S. Szczukiewicz ◽  
John R. Thome ◽  
P. Beucher

Author(s):  
Farhad Saffaraval ◽  
Amir Jokar

The objective of this study is to experimentally explore thermodynamic performance of R245fa, as a low-pressure and environmentally-friendly refrigerant, in a microchannel heat exchanger. This heat exchanger is used in an electronics cooling application with high-power density. Due to the large amount of latent heat that is released during evaporation process, the two-phase microchannel coolers are able to remove much more energy compared to single-phase cooling systems. In this study, R245fa is used as the working fluid in a refrigeration pump loop that mainly includes an evaporator, a condenser, a refrigerant pump, and a pressure regulator valve. The goal is to obtain optimal mass flow rates and system pressures while the temperatures in evaporator and condenser are kept constant for specific conditions. The results obtained from this study are then compared to the results previously obtained for water as the working fluid in a similar cooling system. It is expected the evaporative cooling through the microchannel heat exchanger be a viable and effective solution, especially for higher heat flux applications.


2019 ◽  
Vol 196 ◽  
pp. 00021
Author(s):  
Karapet Eloyan ◽  
Alexey Kreta ◽  
Egor Tkachenko

One of the promising ways of removing large heat fluxes from the surface of heat-stressed elements of electronic devices is the use of evaporating thin layer of liquid film, moving under the action of the gas flow in a flat channel. In this work, a prototype of evaporative cooling system for high heat flux removal with forced circulation of liquid and gas coolants with controlled pulsation, capable to remove heat flux of up to 1,5 kW/cm2 and higher was presented. For the first time the regime with controlled pulsation is used. Due to pulsations, it is possible to achieve high values of critical heat flux due to a brief increase in the flow rate of the liquid, which allows to "wash off" large dry spots and prevent the occurrence of zones of flow and drying.


Author(s):  
Sylwia Szczukiewicz ◽  
Nicolas Lamaison ◽  
Jackson B. Marcinichen ◽  
John R. Thome ◽  
Peter J. Beucher

The main aim of the current paper is to demonstrate the capability of a two-phase closed thermosyphon loop system to cool down a contemporary datacenter rack, passively cooling the entire rack including its numerous servers. The effects on the performance of the entire cooling loop with respect to the server orientation, micro-evaporator design, riser and downcomer diameters, working fluid, and approach temperature difference at the condenser have been modeled and simulated. The influence of the thermosyphon height (here from 5 to 20 cm with a horizontally or vertically oriented server) on the driving force that guarantees the system operation whilst simultaneously fulfilling the critical heat flux (CHF) criterion also has been examined. In summary, the thermosyphon height was found to be the most significant design parameter. For the conditions simulated, in terms of CHF, the 10 cm-high thermosyphon was the most advantageous system design with a minimum safety factor of 1.6 relative to the imposed heat flux of 80 W cm−2. Additionally, a case study including an overhead water-cooled heat exchanger to extract heat from the thermosyphon loop has been developed and then the entire rack cooling system evaluated in terms of cost savings, payback period, and net benefit per year. This approximate study provides a general understanding of how the datacenter cooling infrastructure directly impacts the operating budget as well as influencing the thermal/hydraulic operation, performance, and reliability of the datacenter. Finally, the study shows that the passive two-phase closed loop thermosyphon cooling system is a potentially economically sound technology to cool high heat flux servers of datacenters.


Author(s):  
Kevin P. Drummond ◽  
Doosan Back ◽  
Michael D. Sinanis ◽  
David B. Janes ◽  
Dimitrios Peroulis ◽  
...  

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