Thermal and hydraulic performance enhancement of microchannel heat sinks utilizing porous substrates

Thermal management of electronic equipment is the primary concern in the electronic industry. Miniaturization and high power density of modern electronic components in the energy systems and electronic devices with high power density demanded compact heat exchangers with large heat dissipating capacity. Microchannel heat sinks (MCHS) are the most suitable heat exchanging devices for electronic cooling applications with high compactness. The heat transfer enhancement of the microchannel heat sinks (MCHS) is the most focused research area. Huge research has been done on the thermal and hydraulic performance enhancement of the microchannel heat sinks. This chapter’s focus is on advanced heat transfer enhancement methods used in the recent studies for the MCHS. The present chapter gives information about the performance enhancement MCHS with geometry modifications, Jet impingement, Phase changing materials (PCM), Nanofluids as a working fluid, Flow boiling, slug flow, and magneto-hydrodynamics (MHD).

Download Full-text

AN EXPERIMENTAL STUDY ON PERFORMANCE ENHANCEMENT OF CMOS COMPATIBLE MONOLITHIC MICROCHANNEL HEAT SINKS

Proceeding of Proceedings of CONV-14: International Symposium on Convective Heat and Mass Transfer. June 8 - 13, 2014, Kusadasi, Turkey ◽

10.1615/ichmt.2014.intsympconvheatmasstransf.700 ◽

2014 ◽

Author(s):

Aziz Koyuncuoglu ◽

Goker Turkakar ◽

Matthew Redmond ◽

Tuba Okutucu-Ozyurt ◽

Haluk Kulah ◽

...

Keyword(s):

Experimental Study ◽

Performance Enhancement ◽

Heat Sinks ◽

Microchannel Heat Sinks ◽

Cmos Compatible

Download Full-text

Development of MEMS Microchannel Heat Sinks for Micro/Nano Spacecraft Thermal Control

Microelectromechanical Systems ◽

10.1115/imece2002-39293 ◽

2002 ◽

Cited By ~ 4

Author(s):

Anthony D. Paris ◽

Gajanana C. Birur ◽

Amanda A. Green

Keyword(s):

Heat Sink ◽

Thermal Control ◽

Hydraulic Performance ◽

Heat Sinks ◽

Performance Criteria ◽

Working Fluid ◽

High Heat Flux ◽

Microchannel Heat Sink ◽

Microchannel Heat Sinks ◽

Spacecraft Thermal Control

MEMS-based microchannel heat sinks are being investigated at the Jet Propulsion Laboratory (JPL) for use in micro/nano spacecraft thermal control. The current stage of development focuses on the integration of microchannel heat sinks into spacecraft pumped cooling loops. Two microchannel heat sinks, adapted from a Stanford University Microfluidics Laboratory design, were fabricated at JPL and tested for thermal and hydraulic performance in a single-phase pumped cooling loop. The first microchannel heat sink design was demonstrated to remove heat fluxes of up to 25 W/cm2 with a maximum device temperature of less than 80 °C. Both the original and redesigned heat sinks where shown to meet hydraulic performance criteria requiring less than 1 psi pressure drop with water as the working fluid. It was concluded that the design methodology developed for this project produces microchannel heat sink devices capable of high heat flux removal in future micro/nano spacecraft thermal control architecture.

Download Full-text