scholarly journals A geometrical model for grain boundary migration mediated formation of multifold twins

2022 ◽  
Vol 148 ◽  
pp. 103128
Author(s):  
Yingbin Chen ◽  
Shuchun Zhao ◽  
Qishan Huang ◽  
Qi Zhu ◽  
Kexing Song ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Boundary Migration ◽  
Geometrical Model ◽  
Grain Boundary Migration

Measurement of solute segregation to grain boundaries in the AEM: A review

1988 ◽  
Vol 46 ◽  
pp. 606-607
Author(s):  
D. B. Williams ◽  
A. D. Romig
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Boundary Migration ◽  
Grain Boundary Migration ◽  
Boundary Misorientation ◽  
Collector Plate ◽  
Segregation Process ◽  
Grain Boundary Misorientation ◽  
Structure Boundary ◽  
Equilibrium Segregation

The segregation of solute or imparity elements to grain boundaries can occur by three well-defined processes. The first is Gibbsian segregation in which an element of minimal matrix solubility confines itself to a monolayer at the grain boundary. Classical examples include Bi in Cu and S or P in Fe. The second process involves the depletion of excess matrix solute by volume diffusion to the boundary. In the boundary, the solute atoms diffuse rapidly to precipitates, causing them to grow by the ‘collector-plate mechanism.’ Such grain boundary diffusion is thought to initiate “Diffusion-Induced Grain Boundary Migration,” (DIGM). This process has been proposed as the origin of eutectoid transformations or discontinuous grain boundary reactions. The third segregation process is non-equilibrium segregation which result in a solute build-up around the boundary because of solute-vacancy interactions.All of these segregation phenomena usually occur on a sub-micron scale and are often affected by the nature of the grain boundary (misorientation, defect structure, boundary plane).

Domain coarsening by grain boundary migration in ordered Ni4Mo

1986 ◽  
Vol 44 ◽  
pp. 560-561
Author(s):  
K. Vasudevan ◽  
H. P. Kao ◽  
C. R. Brooks ◽  
E. E. Stansbury
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Short Range ◽  
Boundary Migration ◽  
Grain Boundary Migration ◽  
Rapid Cooling ◽  
Temperature Range ◽  
Fee Structure ◽  
Domain Coarsening ◽  
Boundary Reaction

The Ni4Mo alloy has a short-range ordered fee structure (α) above 868°C, but transforms below this temperature to an ordered bet structure (β) by rearrangement of atoms on the fee lattice. The disordered α, retained by rapid cooling, can be ordered by appropriate aging below 868°C. Initially, very fine β domains in six different but crystallographically related variants form and grow in size on further aging. However, in the temperature range 600-775°C, a coarsening reaction begins at the former α grain boundaries and the alloy also coarsens by this mechanism. The purpose of this paper is to report on TEM observations showing the characteristics of this grain boundary reaction.

STUDY OF THE GRAIN BOUNDARY MIGRATION IN A TRICRISTAL PURE ICE WITH BUBBLES

Anales AFA ◽  
2019 ◽  
Vol 30 (3) ◽  
pp. 47-51
Author(s):  
P.I. Achával ◽  
C. L. Di Prinzio
Keyword(s):  
Monte Carlo ◽  
Grain Boundary ◽  
Numerical Simulations ◽  
Triple Junction ◽  
Boundary Migration ◽  
Optical Microscope ◽  
Physical Parameters ◽  
Grain Boundary Migration

In this paper the migration of a grain triple junction in apure ice sample with bubbles at -5°C was studied for almost 3hs. This allowed tracking the progress of the Grain Boundary (BG) and its interaction with the bubbles. The evolution of the grain triple junction was recorded from successive photographs obtained witha LEICA® optical microscope. Simultaneously, numerical simulations were carried out using Monte Carlo to obtain some physical parameters characteristic of the BG migration on ice.

Effect of grain boundary migration on intergranular fracture in the weld metal of steels

2021 ◽  
pp. 1-9
Author(s):  
Suo Saruwatari ◽  
Takahiro Kamo ◽  
Yuki Nakata ◽  
Kota Kadoi ◽  
Hiroshige Inoue
Keyword(s):  
Grain Boundary ◽  
Weld Metal ◽  
Intergranular Fracture ◽  
Boundary Migration ◽  
Grain Boundary Migration

Increased Thermal Stability of Co-silicide Using Co-Ta Alloy Films

2001 ◽  
Vol 670 ◽  
Author(s):  
Min-Joo Kim ◽  
Hyo-Jick Choi ◽  
Dae-Hong Ko ◽  
Ja-Hum Ku ◽  
Siyoung Choi ◽  
...  
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Grain Boundary ◽  
Reaction Rate ◽  
Boundary Migration ◽  
Grain Boundary Migration ◽  
Alloy Films ◽  
Post Annealing ◽  
Alloy Process ◽  
Thermal Stability Of

ABSTRACTThe silicidation reactions and thermal stability of Co silicide formed from Co-Ta/Si systems have been investigated. In case of Co-Ta alloy process, the formation of low resistive CoSi2phase is delayed to about 660°C, as compared to conventional Co/Si system. Moreover, the presence of Ta in Co-Ta alloy films reduces the silicidation reaction rate, resulting in the strong preferential orientation in CoSi2 films. Upon high temperature post annealing in the furnace, the sheet resistance of Co-silicide formed from Co/Si systems increases significantly, while that of Co-Ta/Si systems maintains low. This is due to the formation of TaSi2 at the grain boundaries and surface of Co-silicide films, which prevents the grain boundary migration thereby slowing the agglomeration. Therefore, from our research, increased thermal stability of Co-silicide films was successfully obtained from Co-Ta alloy process.

Bulk Diffusion-Induced Grain Boundary Migration due to Elastic Anisotropy

1996 ◽  
Vol 207-209 ◽  
pp. 493-496
Author(s):  
A. Katsman ◽  
Leonid Klinger ◽  
L. Levin ◽  
Eugen Rabkin ◽  
W. Gust
Keyword(s):  
Grain Boundary ◽  
Elastic Anisotropy ◽  
Boundary Migration ◽  
Bulk Diffusion ◽  
Grain Boundary Migration
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