Finite element analysis of lithiation-induced decohesion of a silicon thin film adhesively bonded to a rigid substrate under potentiostatic operation

Abstract In this paper, an analytical model is presented to study the contact that recedes between an elastic thin film that could be compressed and a substrate of rigidity. The surface of rigidity was formed due to cylindrical indentation. The substrate was assumed to be a rough surface without any friction. Further, the contact width of the substrate was derived, and the relationship between the compression force, compression depth, and the compression width was determined using the energy method. Finally, the obtained results were validated using finite element analysis.

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Finite element analysis of temperature distribution of polycrystalline silicon thin film transistors under self-heating stress

Frontiers of Electrical and Electronic Engineering in China ◽

10.1007/s11460-009-0023-0 ◽

2009 ◽

Vol 4 (2) ◽

pp. 227-233 ◽

Cited By ~ 5

Author(s):

Huaisheng Wang ◽

Mingxiang Wang ◽

Zhenyu Yang

Keyword(s):

Thin Film ◽

Finite Element Analysis ◽

Finite Element ◽

Temperature Distribution ◽

Thin Film Transistors ◽

Polycrystalline Silicon ◽

Silicon Thin Film ◽

Element Analysis ◽

Self Heating

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Nonlinear Viscoelastic Finite Element Analysis of Adhesive Joints

Tire Science and Technology ◽

10.2346/1.2148803 ◽

1988 ◽

Vol 16 (3) ◽

pp. 146-170 ◽

Cited By ~ 4

Author(s):

S. Roy ◽

J. N. Reddy

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Viscoelastic Behavior ◽

Bonded Joints ◽

Adhesively Bonded ◽

Element Analysis ◽

Adhesively Bonded Joints ◽

Nonlinear Viscoelastic ◽

Structural Failures ◽

Updated Lagrangian

Abstract A good understanding of the process of adhesion from the mechanics viewpoint and the predictive capability for structural failures associated with adhesively bonded joints require a realistic modeling (both constitutive and kinematic) of the constituent materials. The present investigation deals with the development of an Updated Lagrangian formulation and the associated finite element analysis of adhesively bonded joints. The formulation accounts for the geometric nonlinearity of the adherends and the nonlinear viscoelastic behavior of the adhesive. Sample numerical problems are presented to show the stress and strain distributions in bonded joints.

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A Finite Element Analysis for Magnetostrictive Thin Film Structures and Its Experimental Verification

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.306-308.1151 ◽

2006 ◽

Vol 306-308 ◽

pp. 1151-1156 ◽

Cited By ~ 3

Author(s):

Chong Du Cho ◽

Heung Shik Lee ◽

Chang Boo Kim ◽

Hyeon Gyu Beom

Keyword(s):

Thin Film ◽

Finite Element Analysis ◽

Finite Element ◽

Geometric Feature ◽

Hysteresis Phenomenon ◽

Finite Element Code ◽

Element Analysis ◽

Element Mesh ◽

Magnetostrictive Actuators ◽

Large Length

In this paper, a finite element code especially for micro-magnetostrictive actuators was developed. Two significant characteristics of the presented finite element code are: (1) the magnetostrictive hysteresis phenomenon is effectively taken into account; (2) intrinsic geometric feature of typical thin film structures of large length to thickness ratio, which makes it very difficult to construct finite element mesh in the region of the thin film, is considered reasonably in modeling micro-magneostrictive actuators. For verification purpose, magnetostrictive thin films were fabricated and tested in the form of a cantilevered actuator. The Tb-Fe film and Sm-Fe film are sputtered on the Si and Polyimide substrates individually. The magnetic and magnetostrictive properties of the sputtered magnetostrictive films are measured. The measured magnetostrictive coefficients are compared with the numerically calculated ones.

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