Formation and morphology of the intermetallic compounds formed at the 91Sn–8.55Zn–0.45Al lead-free solder alloy/Cu interface

2005 ◽  
Vol 389 (1-2) ◽  
pp. 133-139 ◽  
Author(s):  
Moo-Chin Wang ◽  
Shan-Pu Yu ◽  
Tao-Chih Chang ◽  
Min-Hsiung Hon
Keyword(s):  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

scholarly journals Analysis of Microstructure and Mechanical Properties of Bismuth-Doped SAC305 Lead-Free Solder Alloy at High Temperature

Metals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 1077
Author(s):  
Umair Ali ◽  
Hamza Khan ◽  
Muhammad Aamir ◽  
Khaled Giasin ◽  
Numan Habib ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Thermal Aging ◽  
Lead Free ◽  
Lead Free Solder ◽  
Scanning Calorimetry ◽  
X Ray ◽  
Lead Free Solder Alloy ◽  
Free Solder

SAC305 lead-free solder alloy is widely used in the electronic industry. However, the problems associated with the growth formation of intermetallic compounds need further research, especially at high temperatures. This study investigates the doping of Bismuth into SAC305 in the various compositions of 1, 2, and 3 wt.%. The microstructure in terms of intermetallic compound particles and mechanical properties was examined after thermal aging at temperatures of 100 °C and 200 °C for 60 h. The microstructure examination was observed using scanning electron microscopy, and the chemical composition of each alloy was confirmed with an energy dispersive X-ray. Tensile tests were performed to find the mechanical properties such as yield strength and ultimate tensile strength. The intermetallic compound’s phase analysis was identified using X-ray diffraction, and differential scanning calorimetry was done to study the temperature curves for melting points. Results showed that the addition of Bismuth refined the microstructure by suppressing the growth of intermetallic compounds, which subsequently improved the mechanical properties. The thermal aging made the microstructure coarsen and degraded the mechanical properties. However, the most improved performance was observed with a Bismuth addition of 3 wt.% into SAC305. Furthermore, a decrease in the melting temperature was observed, especially at Bismuth compositions of 3 wt.%.

Characterization of Co–Sn intermetallic compounds in Sn–3.0Ag–0.5Cu–0.5Co lead-free solder alloy

2008 ◽  
Vol 62 (15) ◽  
pp. 2257-2259 ◽  
Author(s):  
Feng Gao ◽  
Fangjie Cheng ◽  
Hiroshi Nishikawa ◽  
Tadashi Takemoto
Keyword(s):  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

scholarly journals Distribution and Microstructure Analysis of Ceramic Particles in the Lead-Free Solder Matrix

2020 ◽  
Author(s):  
Manoj Kumar Pal ◽  
Gréta Gergely ◽  
Dániel Koncz-Horváth ◽  
Zoltán Gácsi
Keyword(s):  
Silicon Carbide ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Solder Matrix ◽  
Microstructure Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sac305 Solder ◽  
Small Change ◽  
Free Solder

Abstract The Sn-3.0Ag-0.5Cu solder alloy is a prominent candidate for the Pb-free solder, and SAC305 solder is generally employed in today’s electronic enterprise. In this study, the formation of intermetallic compounds (Cu6Sn5 and Ag3Sn) at the interface, average neighbour’s particle distance, and the morphological mosaic are examined by the addition of SiC and nickel-coated silicon carbide reinforcements within Sn-3.0Ag-0.5Cu solder. Results revealed that the addition of SiC and SiC(Ni) particles are associated with a small change to the average neighbor’s particle distance and a decrease of clustering rate to a certain limit of the Sn-3.0Ag-0.5Cu solder composites. Moreover, the development of the Cu6Sn5 and the structure of the Ag3Sn are improved with the addition of SiC and Ni coated SiC.

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

2020 ◽  
Vol 43 (12) ◽  
pp. 2883-2891
Author(s):  
Q.B. Tao ◽  
L. Benabou ◽  
Van Nhat Le ◽  
Ngoc Anh Thi Nguyen ◽  
Hung Nguyen‐Xuan
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Dependent ◽  
Lead Free Solder Alloy ◽  
Free Solder

Sn-Mg lead-free solder alloy: Effect of solidification thermal parameters on microstructural features and microhardness

2019 ◽  
Vol 6 (12) ◽  
pp. 126562 ◽  
Author(s):  
Clarissa B da Cruz ◽  
Thiago S Lima ◽  
Thiago A Costa ◽  
Crystopher Brito ◽  
Amauri Garcia ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Thermal Parameters ◽  
Lead Free ◽  
Lead Free Solder ◽  
Alloy Effect ◽  
Lead Free Solder Alloy ◽  
Free Solder

Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

2017 ◽  
Vol 751 ◽  
pp. 9-13
Author(s):  
Kogaew Inkong ◽  
Phairote Sungkhaphaitoon
Keyword(s):  
Mechanical Properties ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Testing Machine ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cooling Systems ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of cooling rate on the microstructural and mechanical properties of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy was studied. The microstructure of specimens was characterized by using an optical microscope (OM) and an energy dispersive X-ray spectroscopy (EDX). The mechanical properties were performed by using a universal testing machine (UTM). The results showed that the cooling rate of water-cooled specimens was about 2.37 °C/s and the cooling rate of mold-cooled specimens was about 0.05 °C/s. To compare the different cooling rates, it was found that the grain size of water-cooled specimens was finer than that of the mold-cooled specimens, this resulted in an increment of mechanical properties of solder alloy. A higher tensile strength (33.10 MPa) and a higher elongation (34%) were observed when water-cooled and mold-cooled systems were used, respectively. The microstructure of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy solidified by both cooling systems exhibited three phases: β-Sn, Ag3Sn and (Cu,Ni)6Sn5 IMCs.

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