Growth kinetics of intermetallic compounds between Sn–9Zn solder and electroplated Fe–42Ni metallization

2009 ◽  
Vol 487 (1-2) ◽  
pp. 776-780 ◽  
Author(s):  
X.F. Zhang ◽  
J.D. Guo ◽  
J.K. Shang
2014 ◽  
Vol 90 ◽  
pp. 121-126 ◽  
Author(s):  
M. Movahedi ◽  
A.H. Kokabi ◽  
S.M. Seyed Reihani ◽  
H. Najafi ◽  
S.A. Farzadfar ◽  
...  

2018 ◽  
Vol 96 ◽  
pp. 1-12 ◽  
Author(s):  
H.R. Ma ◽  
A. Kunwar ◽  
S.Y. Shang ◽  
C.R. Jiang ◽  
Y.P. Wang ◽  
...  

2001 ◽  
Vol 44 (2) ◽  
pp. 317-323 ◽  
Author(s):  
P.L Tu ◽  
Y.C Chan ◽  
K.C Hung ◽  
J.K.L Lai

Sign in / Sign up

Export Citation Format

Share Document