The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn-0.7Cu -0.4Co eutectic solder and ENIG/Cu substrate finish

2008 ◽  
Author(s):  
Lili Zhang ◽  
C. Andersson ◽  
J. Liu ◽  
Zhaonian Cheng
Keyword(s):  
Intermetallic Compounds ◽  
Growth Kinetics ◽  
Eutectic Solder ◽  
Cu Substrate ◽  
Reflow Temperature ◽  
Kinetics Of

Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging

2005 ◽  
Vol 475-479 ◽  
pp. 2627-2630
Author(s):  
Soon Tae Kim ◽  
Joo Youl Huh
Keyword(s):  
Growth Rate ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Interfacial Reaction ◽  
Growth Kinetics ◽  
Cu Substrate ◽  
Reaction Barrier ◽  
Cu3sn Layer ◽  
Cu6sn5 Layer ◽  
Kinetics Of

The effect of adding Bi to a eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints was examined at the aging temperatures of 130°C, 150°C and 180°C. At 150°C and 180°C, the growth rate of the Cu6Sn5 layer was significantly enhanced, but that of the Cu3Sn layer was rather reduced with increasing Bi content up to 12 wt.%. At 130°C, however, both the η and ε layers appeared to grow faster as the Bi content in the solder was increased to 12 wt.%. These results suggest that the accumulation of Bi ahead of the Cu6Sn5 layers can affect not only the interfacial reaction barrier but also the local thermodynamics at the interface between the Cu6Sn5 layer and the solder.

Growth Kinetics of Intermetallic Compounds at the Interface of Liquid Sn-9Zn/Cu

2011 ◽  
Vol 233-235 ◽  
pp. 2323-2327
Author(s):  
Hui Zhen Huang ◽  
Xiu Qin Wei ◽  
Lang Zhou
Keyword(s):  
Activation Energy ◽  
Intermetallic Compound ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Growth Kinetics ◽  
Layer Growth ◽  
Experimental Results ◽  
Cu Substrate ◽  
Diffusion Mechanisms ◽  
Kinetics Of

The morphology and growth of the intermetallic compound (IMC) formed between liquid Sn-9Zn eutectic solder alloy and Cu at 220-260°C was investigated. Experimental results showed that γ-Cu5Zn8 was present at the Sn-9Zn/Cu interface as the reaction product. The IMC layer growth follows the parabolic-growth law, which indicates that the growth of the IMC is controlled by the diffusion mechanisms. The activation energy of γ-Cu5Zn8 layer growth for liquid Sn-9Zn reacting with Cu substrate is determined as 50.5 KJ/mol.

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