Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures

2015 ◽  
Vol 619 ◽  
pp. 325-331 ◽  
Author(s):  
H. Xu ◽  
V. Vuorinen ◽  
H. Dong ◽  
M. Paulasto-Kröckel
2021 ◽  
Vol 227 ◽  
pp. 111014
Author(s):  
Chien-Chung Hsu ◽  
Sheng-Min Yu ◽  
Kun-Mu Lee ◽  
Chuan-Jung Lin ◽  
Hao-Chien Cheng ◽  
...  

2003 ◽  
Vol 18 (1) ◽  
pp. 4-7 ◽  
Author(s):  
Y. C. Sohn ◽  
Jin Yu ◽  
S. K. Kang ◽  
W. K. Choi ◽  
D. Y. Shih

The reaction mechanism between electroless Ni–P and Sn was investigated to understand the effects of Sn on solder reaction-assisted crystallization at low temperatures as well as self-crystallization of Ni–P at high temperatures. Ni3Sn4 starts to form in a solid-state reaction well before Sn melts. Heat of reaction for Ni3Sn4 was measured during the Ni–P and Sn reaction (241.2 J/g). It was found that the solder reaction not only promotes crystallization at low temperatures by forming Ni3P in the P-rich layer but also facilitates self-crystallization of Ni–P by reducing the transformation temperature and heat of crystallization. The presence of Sn reduces the self-crystallization temperature of Ni–P by about 10 °C. The heat of crystallization also decreases with an increased Sn thickness.


2013 ◽  
Vol 5 (4) ◽  
pp. 1310-1316 ◽  
Author(s):  
Chunhui Miao ◽  
Tongfei Shi ◽  
Guoping Xu ◽  
Shulin Ji ◽  
Changhui Ye

2019 ◽  
Vol 38 (2019) ◽  
pp. 347-353 ◽  
Author(s):  
Xueliang Zhang ◽  
Shufeng Yang ◽  
Jingshe Li ◽  
Chengsong Liu ◽  
Wei-xing Hao

AbstractTo clarify the evolution of interfacial features between MnO-SiO2 type inclusions and Si-Mn killed steel during isothermal heating at low temperatures, two diffusion couple samples were investigated under heat treatment at 1173 K and 1273 K, respectively. The experimental results show that the diffusion of oxygen from the oxide to the alloy is the restrictive link of the solid-state reaction between MnO-SiO2-FeO oxide and steel matrix at low heating temperatures. With increasing heating time or temperature, more FeO in the oxide decomposed, and the resulting oxygen diffused into the alloy and reacted with Mn and Si elements. The critical heating temperature at which the interfacial reaction can occur was determined to be 1173 K. And a dynamic model that predicts the change in the width of the particles precipitation zone at low temperatures was also established based on Wagner equation.


1994 ◽  
Vol 83 (1) ◽  
pp. 333-339 ◽  
Author(s):  
A. Paesano ◽  
S. R. Teixeira ◽  
L. Amaral

1995 ◽  
Vol 67 (7) ◽  
pp. 947-949 ◽  
Author(s):  
K. J. Duxstad ◽  
E. E. Haller ◽  
K. M. Yu ◽  
E. D. Bourret ◽  
J. M. Walker ◽  
...  

1990 ◽  
Vol 187 ◽  
Author(s):  
B. Blanpain ◽  
J.W. Mayer

AbstractWe show that the decagonal Al3Pd phase can be formed by solid state reaction in lateral and conventional thin film couples of Al and Pd. The metastable decagonal phase forms after the initial growth of the Al3Pd2 compound.


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