scholarly journals Three-dimensional nucleation with diffusion controlled growth: A comparative study of electrochemical phase formation from aqueous and deep eutectic solvents

2017 ◽  
Vol 793 ◽  
pp. 119-125 ◽  
Author(s):  
Paula Sebastián ◽  
Luis E. Botello ◽  
Elisa Vallés ◽  
Elvira Gómez ◽  
Manuel Palomar-Pardavé ◽  
...  
Keyword(s):  
Comparative Study ◽  
Phase Formation ◽  
Three Dimensional ◽  
Deep Eutectic Solvents ◽  
Controlled Growth ◽  
Diffusion Controlled

Three-dimensional nucleation with diffusion controlled growth

1984 ◽  
Vol 177 (1-2) ◽  
pp. 25-37 ◽  
Author(s):  
J. Mostany ◽  
J. Mozota ◽  
B.R. Scharifker
Keyword(s):  
Three Dimensional ◽  
Controlled Growth ◽  
Diffusion Controlled

scholarly journals Electrochemical Behavior and Electrodeposition of Sn Coating from Choline Chloride–Urea Deep Eutectic Solvents

Coatings ◽  
2020 ◽  
Vol 10 (12) ◽  
pp. 1154
Author(s):  
Xiaozhou Cao ◽  
Lulu Xu ◽  
Chao Wang ◽  
Siyi Li ◽  
Dong Wu ◽  
...  
Keyword(s):  
Electrochemical Behavior ◽  
Choline Chloride ◽  
Three Dimensional ◽  
Deep Eutectic Solvents ◽  
Xrd Analysis ◽  
Single Step ◽  
Tungsten Electrode ◽  
Diffusion Controlled ◽  
Nucleation Overpotential ◽  
And Diffusion

The electrochemical behavior and electrodeposition of Sn were investigated in choline chloride (ChCl)–urea deep eutectic solvents (DESs) containing SnCl2 by cyclic voltammetry (CV) and chronoamperometry techniques. The electrodeposition of Sn(II) was a quasi-reversible, single-step two-electron-transfer process. The average transfer coefficient and diffusion coefficient of 0.2 M Sn(II) in ChCl–urea at 323 K were 0.29 and 1.35 × 10−9 cm2∙s−1. The nucleation overpotential decreased with the increase in temperature and SnCl2 concentration. The results of the chronoamperometry indicated that the Sn deposition on tungsten electrode occurred by three-dimensional instantaneous nucleation and diffusion controlled growth using the Scharifker–Hills model. Scanning electron microscopy (SEM) showed that the morphology of the deposits is uniform, as a dense and compact film prepared by potentiostatic electrolysis on Cu substrate. X-ray diffraction (XRD) analysis revealed that the deposits were pure metallic Sn.

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