scholarly journals Sustainable Additive Manufacturing of Printed Circuit Boards

Joule ◽  
2018 ◽  
Vol 2 (4) ◽  
pp. 579-582 ◽  
Author(s):  
Yue Dong ◽  
Chao Bao ◽  
Woo Soo Kim
Keyword(s):  
Additive Manufacturing ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit

Heterogeneous Process Development for Electronic Device Packaging with Direct Printed Additive Manufacturing

2012 ◽  
Vol 2012 (1) ◽  
pp. 000961-000966
Author(s):  
R. X. Rodriguez ◽  
K. Church ◽  
X. Chen
Keyword(s):  
Additive Manufacturing ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Process Development ◽  
Electronic Device ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Wire Bonds ◽  
The Status

Next generation electronics will not change drastically in function; batteries will last longer, devices will have more functions and devices will take unique shapes, but for the next several years, electronics will travel the path it has been traveling for a couple of decades. To meet the demands of more functions per device and unique shapes, the status quo of electronic manufacturing cannot persist. Solder, wire bonds, FR4, printed circuit boards, surface mount and packaging will fight for survival, but just as hand held phones have evolved, so will the electronics that support them. Standard electronic packaging techniques are reaching size and density limits forcing a search for alternative approaches. The idea of using Additive Manufacturing as an alternative for packaging has not been taken seriously, but there is an opportunity to demonstrate the significant advantages of true 3D electronic packages by allowing the package to be the printed circuit board and by utilizing direct print and bare die approaches to print and structure diverse electronics.

Slit Effect of Common Ground Patterns in Affecting Cross-Talk Noise between Two Parallel Signal Traces on Printed Circuit Boards

2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara
Keyword(s):  
Cross Talk ◽  
Printed Circuit Boards ◽  
Common Ground ◽  
Circuit Boards ◽  
Printed Circuit

Influence of Component Mounting Density on Oscillating Characteristics of Multilayer Printed Circuit Boards

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Oscillating Characteristics

Noise properties of thin-film Ni-P resistors embedded in printed circuit boards

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic
Keyword(s):  
Thin Film ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Noise Component ◽  
Printed Circuit ◽  
Resistance Bridge ◽  
Different Types ◽  
Signal Path ◽  
Resistance Fluctuations ◽  
Made In

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.

LEACHING OF METALS FROM WASTE PRINTED CIRCUIT BOARDS (WPCBs) USING SULFURIC AND NITRIC ACIDS

2014 ◽  
Vol 13 (10) ◽  
pp. 2601-2607 ◽  
Author(s):  
Jae-chun Lee ◽  
Manoj Kumar ◽  
Min-Seuk Kim ◽  
Jinki Jeong ◽  
Kyoungkeun Yoo
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards
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