Heterogeneous Process Development for Electronic Device Packaging with Direct Printed Additive Manufacturing

2012 ◽  
Vol 2012 (1) ◽  
pp. 000961-000966
Author(s):  
R. X. Rodriguez ◽  
K. Church ◽  
X. Chen
Keyword(s):  
Additive Manufacturing ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Process Development ◽  
Electronic Device ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Wire Bonds ◽  
The Status

Next generation electronics will not change drastically in function; batteries will last longer, devices will have more functions and devices will take unique shapes, but for the next several years, electronics will travel the path it has been traveling for a couple of decades. To meet the demands of more functions per device and unique shapes, the status quo of electronic manufacturing cannot persist. Solder, wire bonds, FR4, printed circuit boards, surface mount and packaging will fight for survival, but just as hand held phones have evolved, so will the electronics that support them. Standard electronic packaging techniques are reaching size and density limits forcing a search for alternative approaches. The idea of using Additive Manufacturing as an alternative for packaging has not been taken seriously, but there is an opportunity to demonstrate the significant advantages of true 3D electronic packages by allowing the package to be the printed circuit board and by utilizing direct print and bare die approaches to print and structure diverse electronics.

Dielectric Breakdown in Printed Circuit Boards at Elevated Temperatures

1996 ◽  
Author(s):  
P. Singh ◽  
G.T. Galyon ◽  
J. Obrzut ◽  
W.A. Alpaugh
Keyword(s):  
Experimental Data ◽  
Thermal Degradation ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Elevated Temperatures ◽  
Dielectric Breakdown ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Data Matching

Abstract A time delayed dielectric breakdown in printed circuit boards, operating at temperatures below the epoxy resin insulation thermo-electrical limits, is reported. The safe temperature-voltage operating regime was estimated and related to the glass-rubber transition (To) of printed circuit board dielectric. The TG was measured using DSC and compared with that determined from electrical conductivity of the laminate in the glassy and rubbery state. A failure model was developed and fitted to the experimental data matching a localized thermal degradation of the dielectric and time dependency. The model is based on localized heating of an insulation resistance defect that under certain voltage bias can exceed the TG, thus, initiating thermal degradation of the resin. The model agrees well with the experimental data and indicates that the failure rate and truncation time beyond which the probability of failure becomes insignificant, decreases with increasing glass-rubber transition temperature.

Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

Circuit World ◽  
2016 ◽  
Vol 42 (1) ◽  
pp. 32-36 ◽  
Author(s):  
Michal Baszynski ◽  
Edward Ramotowski ◽  
Dariusz Ostaszewski ◽  
Tomasz Klej ◽  
Mariusz Wojcik ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
New Technologies ◽  
Electronic Device ◽  
Circuit Board ◽  
New Materials ◽  
Content Type ◽  
Printed Circuit

Purpose – The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies. Design/methodology/approach – Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties. Findings – The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how a simple alteration to the design can help to improve the thermal performance of electronic device. Proper layout, new materials and technologies of PCB manufacturing can significantly reduce the temperature of electronic components resulting in higher reliability of electronic and power electronic devices. Originality/value – This paper shows the advantages of new technologies and materials in PCB thermal management.

scholarly journals A model for the reflection of terahertz signals from printed circuit board surfaces

2018 ◽  
Vol 10 (2) ◽  
pp. 179-186 ◽  
Author(s):  
Alexander Fricke ◽  
Mounir Achir ◽  
Philippe Le Bars ◽  
Thomas Kürner
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Simulated Annealing Algorithm ◽  
Specular Reflection ◽  
Circuit Board ◽  
Network Analyzer ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Propagation Modeling ◽  
Annealing Algorithm

AbstractBased on vector network analyzer Measurements, a model for the specular reflection behavior of printed circuit boards in the Terahertz range has been derived. It has been calibrated to suit the behavior of the measurements using a simulated annealing algorithm. The model has been tailored for integration to ray-tracing-based propagation modeling.

scholarly journals NotchPUF: Printed Circuit Board PUF Based on Microstrip Notch Filter

Cryptography ◽  
2020 ◽  
Vol 4 (2) ◽  
pp. 11
Author(s):  
Mitchell Martin ◽  
Jim Plusquellic
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Statistical Tests ◽  
Notch Filter ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
In Series ◽  
Commercial Off The Shelf ◽  
Using Data

Physical Unclonable Functions (PUFs) are primitives that are designed to leverage naturally occurring variations to produce a random bitstring. Current PUF designs are typically implemented in silicon or utilize variations found in commercial off-the-shelf (COTS) parts. Because of this, existing designs are insufficient for the authentication of Printed Circuit Boards (PCBs). In this paper, we propose a novel PUF design that leverages board variations in a manufactured PCB to generate unique and stable IDs for each PCB. In particular, a single copper trace is used as a source of randomness for bitstring generation. The trace connects three notch filter structures in series, each of which is designed to reject specific but separate frequencies. The bitstrings generated using data measured from a set of PCBs are analyzed using statistical tests to illustrate that high levels of uniqueness and randomness are achievable.

Downsizing an automotive junction box based on large current-carrying printed-circuit board optimization

2016 ◽  
Vol 231 (2) ◽  
pp. 267-278 ◽  
Author(s):  
Hansang Lim ◽  
Do-Hwan Jung ◽  
Geono Kwon ◽  
Young Jong Lee ◽  
Jun Seo Park
Keyword(s):  
Power Distribution ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Installation Space ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Overcurrent Protection ◽  
Large Current ◽  
Analytical Estimation

An automotive junction box distributes electric power to electric systems installed in a vehicle with overcurrent protection. As a larger number of electric systems are installed, the junction box is equipped with more components, functionalities and connections. However, owing to the fuse accessibility, its installation space is so restricted that a downsized design is required for the junction box. The junction box is composed of small signal circuitry for control and monitoring, and large current-carrying circuitry for power distribution which includes many parallel traces. Because of these unique features, widely used techniques for downsizing printed-circuit boards are not applicable. Also, there is no rule for designing large current-carrying parallel traces, and it is difficult to optimize the size of the printed-circuit board for the automotive junction box. This paper presents the design rules for a printed-circuit board when downsizing a junction box. First, the layout strategy for the power distribution components is presented, which is determined by the sum of the squares of the currents flowing through connector pairs. Then, the thermal effects of parallel traces are simulated for different conditions by using thermal analysis software. Based on the results, an analytical estimation of the additional temperature rises due to parallel traces and rules for a thermally effective arrangement of the parallel traces are presented.

Future paper based printed circuit boards for green electronics: fabrication and life cycle assessment

2014 ◽  
Vol 7 (11) ◽  
pp. 3674-3682 ◽  
Author(s):  
Jingping Liu ◽  
Cheng Yang ◽  
Haoyi Wu ◽  
Ziyin Lin ◽  
Zhexu Zhang ◽  
...  
Keyword(s):  
Life Cycle Assessment ◽  
Life Cycle ◽  
Environmental Impact ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Future Paper ◽  
Printing Paper

A multilayer printed circuit board (PCB) can be fabricated using commercially available printing paper, which shows comparable functionalities with the conventional organic PCBs but 100 times lower environmental impact.

Advanced Materials for Printed Circuit Boards

1987 ◽  
Vol 108 ◽  
Author(s):  
David Wei Wang
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Circuit Board ◽  
Advanced Materials ◽  
Impregnation Method ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Worldwide Production ◽  
Board Industry

The printed circuit board is an integral part of the electronic packaging hierarchy. Its use began more than 40 years ago, and the demand for printed circuit boards has increased in parallel with the growth of the electronics industry.[1] According to a recent forecast, the worldwide production of printed circuit boards will reach to over 19 billion U.S. dollars' worth by 1990.[2] With continuing demands for more interconnections, the multilayer circuit board industry is experiencing its fastest growth rate. Boards with more than 20 inner planes of circuitry are being manufactured with high reliability.Based on dollar values, more than 90% of the circuit boards produced are in the rigid board category, where starting materials are based on thermosetting prepregs produced by a solution impregnation method. This article is a review of materials currently used in rigid composites.

scholarly journals MODIFICATION OF TOOL FOR MOVING TRACK SEGMENTS IN DELTA DESIGN CAD

2019 ◽  
pp. 130-133
Author(s):  
A. Yu. Gladkevich
Keyword(s):  
Computer Aided Design ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Design System ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Advantages And Disadvantages ◽  
Development Tools ◽  
Aided Design

Describes the process of improving and developing tools in computer‑aided design system Delta Design. Currently, the modern  process of PCB development is quite complex and time‑consuming process. Existing CAD systems make it easier to design a  printed circuit Board model by providing powerful development tools. Along with the increasing complexity of modern printed  circuit boards, the requirements for development tools are also growing, making them constantly improve. Using the example  of  the  Delta  Design  system,  the  process  of  improving  the  tool  for  moving  track  segments  is  described.  The  analysis  of  the  advantages and disadvantages of the existing tool is made, and the decision on the need to develop a new algorithm is justified.  Of the two proposed variants of such an algorithm, the optimal one was chosen in terms of the quality of the result obtained and  the convenience of operation.

scholarly journals Evaluation of printed-circuit boards materials for high temperature operation

2017 ◽  
Vol 2017 (HiTEN) ◽  
pp. 000057-000062
Author(s):  
Oriol Aviño-Salvado ◽  
Wissam Sabbah ◽  
Cyril Buttay ◽  
Hervé Morel ◽  
Pascal Bevilacqua
Keyword(s):  
High Temperature ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Physical Measurements ◽  
Epoxy Material ◽  
High Temperature Operation

ABSTRACT This article presents the long term (1000 h) behaviour of two printed-circuit board materials (Panasonic R1755V, a high-TG glass-epoxy composite and Arlon 85N, a polyimide-based laminate) stored at high temperature (190 °C). Tests are performed in air and in nitrogen atmospheres. Electrical and physical measurements are performed regularly (once per week). Almost no degradation is observed for both materials, when stored in nitrogen. On the contrary, the board stored in air show the consequences of ageing. This is especially true for the glass-epoxy material, which becomes unusable after 2 weeks, because of large swelling.

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