Diffusion bonding of TiAl intermetallic and Ti3AlC2 ceramic: Interfacial microstructure and joining properties

2014 ◽  
Vol 56 ◽  
pp. 115-121 ◽  
Author(s):  
Jian Cao ◽  
Jiakun Liu ◽  
Xiaoguo Song ◽  
Xingtao Lin ◽  
Jicai Feng
Keyword(s):  
Diffusion Bonding ◽  
Interfacial Microstructure

Diffusion bonding and interfacial microstructure analysis of AlMgB14–TiB2 to Nb

2015 ◽  
Vol 41 (3) ◽  
pp. 3833-3838 ◽  
Author(s):  
Yongzhong Zhang ◽  
Lifang Hu ◽  
Qingsen Meng ◽  
Wenxian Wang ◽  
Wen Liu
Keyword(s):  
Diffusion Bonding ◽  
Interfacial Microstructure ◽  
Microstructure Analysis

Vacuum diffusion bonding W to W-Cu composite: Interfacial microstructure and mechanical properties

Vacuum ◽  
2019 ◽  
Vol 165 ◽  
pp. 19-25 ◽  
Author(s):  
Haixiang Yan ◽  
Jinglian Fan ◽  
Yong Han ◽  
Qing Yao ◽  
Tao Liu ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Diffusion Bonding ◽  
Interfacial Microstructure ◽  
Microstructure And Mechanical Properties

Interfacial Microstructure of Diffusion-Bonded and Annealed Cu-10Fe/Al6061 Clad Material

2012 ◽  
Vol 248 ◽  
pp. 60-65
Author(s):  
Ju Young Jin ◽  
Sun Ig Hong
Keyword(s):  
Diffusion Bonding ◽  
Energy Dispersive Spectrometry ◽  
Compound Layer ◽  
Interfacial Microstructure ◽  
Intermetallic Compound Layer ◽  
Strengthening Effect ◽  
Layer Formation ◽  
Al 6061 ◽  
Kinetics Of ◽  
Intermetallic Layers

Diffusion bonding between the Cu-10%Fe and Al6061 alloys were successfully achieved at various temperatures (450-525°C) in the argon atmosphere. The bonding interface regions were analyzed using scanning electron microscopy and energy dispersive spectrometry and XRD. The presence of Fe particles in Cu was found to have an influence on the kinetics of intermetallic compound layer formation. Cu-Fe/Al 6061 exhibited the slower growth rate of intermetallic layers than Cu/Al 6061 after diffusion bonding. The movement of Cu-Fe/Cu9Al4 interface into Cu-Fe substrate appears to be hindered by the presence of populated Fe-containing particles and filaments. In addition to Cu9Al4, CuAl and CuAl2 intermetallic layers, Al7Cu2Fe and unreacted Fe were observed to be present in the intermetallic layers. The intermetallic layers which are close to Cu such as Cu9Al4 and CuAl were observed to be harder in Cu-10%Fe/Al 6061 than in Cu/Al 6061, suggesting Fe and its intermetallics have some strengthening effect on Cu9Al4 and CuAl.

Interfacial Microstructure of Diffusion-Bonded Cu/Cu-Ag/Al Hybrid Alloy

2013 ◽  
Vol 683 ◽  
pp. 128-132
Author(s):  
In Ho Lee ◽  
Kap Ho Lee ◽  
Sun Ig Hong
Keyword(s):  
Diffusion Bonding ◽  
Intermediate Layer ◽  
Interfacial Microstructure ◽  
Interface Region ◽  
Interface Microstructure ◽  
Vickers Indentation ◽  
Intermetallic Layers

Cu and Al6061 alloys were diffusion-bonded at 530°C with Cu-15 wt. % Ag alloy as an intermediate layer and the interface microstructure were analyzed. The presence of Cu9Al4, CuAl and CuAl2intermetallic layers were confirmed along with Ag3Mg and AgMg intermetallics. Ag was found to diffuse into Al, forming needle-shaped Ag2Al precipitates in Al substrate close to Al/Cu-Ag interface region. Micro-Vickers indentation aimed at the interface regions, CuAl/CuAl2and CuAl2/Ag3Mg-AgMg lamella revealed that cracks were formed mostly around the indenter mark in CuAl2layer more than in CuAl and no cracks in the Ag3Mg-AgMg lamella region, suggesting CuAl2is more brittle than CuAl and Ag3Mg-AgMg lamella is rather ductile. Ag3Mg-AgMg lamella was found to be formed at the interface between Al and CuAl2. The formation of ductile Ag3Mg-AgMg lamella at the Al interface suggests that the diffusion bonding Cu and Al with Cu-Ag or Ag as a intermediate layer may increases the interface reliability of Cu/Al hybrid alloy.

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