A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air

2018 ◽  
Vol 140 ◽  
pp. 64-72 ◽  
Author(s):  
Jie Li ◽  
Xin Li ◽  
Lei Wang ◽  
Yun-Hui Mei ◽  
Guo-Quan Lu
2007 ◽  
Vol 36 (10) ◽  
pp. 1333-1340 ◽  
Author(s):  
Tao Wang ◽  
Xu Chen ◽  
Guo-Quan Lu ◽  
Guang-Yin Lei

Author(s):  
Kisho Ashida ◽  
Kenya Kawano ◽  
Naotaka Tanaka ◽  
Atsushi Nishikizawa ◽  
Nobuya Koike

Evaluating silver paste strength for die bonding during the reflow soldering process is important, as silver paste fracturing is one of the main causes of package failure. First, we assumed that the fracturing was caused by thermal stress and vapor pressure at the interface between the resin and the copper lead frame. Next, we measured the silver paste fracture strength using a three-point bending test and a bonded specimen with silver paste. Finally, we predicted the occurrence of silver paste fracturing by calculating the silver paste stress during reflow soldering process and comparing it with the measured fracture strength. Results obtained in strength evaluation analysis were consistent with those obtained in package reflow tests, indicating that this method can be used to predict the occurrence of silver paste fracturing.


2004 ◽  
Vol 12 (4) ◽  
pp. 391-398 ◽  
Author(s):  
Seong-Dae Park ◽  
Myong-Jae Yoo ◽  
Nam-Kee Kang ◽  
Jong-Chul Park ◽  
Jin-Kyu Lim ◽  
...  
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