Low temperature joining of GH3039 for high temperature applications with Au-Si isothermal solidification

2020 ◽  
Vol 281 ◽  
pp. 128668
Author(s):  
Wanqi Zhao ◽  
Panpan Lin ◽  
Tiesong Lin ◽  
Peng He ◽  
Weimin Long ◽  
...  
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Isothermal Solidification ◽  
Temperature Applications

Progress of Research on Welding for Molybdenum Alloys

2014 ◽  
Vol 33 (3) ◽  
pp. 193-200 ◽  
Author(s):  
Jiteng Wang ◽  
Juan Wang ◽  
Yajiang Li ◽  
Deshuang Zheng
Keyword(s):  
High Temperature ◽  
Elevated Temperature ◽  
Low Temperature ◽  
Welded Joint ◽  
Structural Materials ◽  
Practical Applications ◽  
Traditional Technology ◽  
Molybdenum Alloys ◽  
Resistance To Oxidation ◽  
Temperature Applications

AbstractMolybdenum and molybdenum alloys are considered to be attractive structural materials for high-temperature applications. However, molybdenum alloys are sensitive to gas impurities and have the characteristics of low temperature embrittlement and less resistance to oxidation at elevated temperature. The toughness and strength of welded joint is not easy to be ensured by traditional technology. Recently, many efforts have been made to join molybdenum and its alloys. In this paper, we present the result of investigations on welding methods of molybdenum and its alloys and overview the practical applications in engineering. The key of joining molybdenum alloys is to improve the toughness of welded joint and prevent the generation of pores and cracks.

Development of a Wire-Bond Technology for SiC High Temperature Applications

2010 ◽  
Vol 645-648 ◽  
pp. 749-752 ◽  
Author(s):  
Nicolas Heuck ◽  
F. Baars ◽  
Andrey Bakin ◽  
A. Waag
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Low Temperature ◽  
High Temperatures ◽  
Silver Wire ◽  
Wire Bond ◽  
Thick Wire ◽  
Temperature Applications

In this paper a wire-bond technology for high temperatures (up to 500°C) based on silver-wire is presented. The mechanical properties of silver thick-wire wedge bonds are analyzed and compared to previously presented silver-stripes fastened onto the chip with the Low Temperature Joining Technique (LTJT) and to common aluminum thick-wire.

Low temperature routes to joining ceramics for high-temperature applications

1994 ◽  
Vol 31 (8) ◽  
pp. 1043-1048 ◽  
Author(s):  
B.J. Dalgleish ◽  
A.P. Tomsia ◽  
K. Nakashima ◽  
M.R. Locatelli ◽  
A.M. Glaeser
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Temperature Applications

Fiber-optic Fabry–Perot pressure sensor based on low-temperature co-fired ceramic technology for high-temperature applications

2018 ◽  
Vol 57 (15) ◽  
pp. 4211 ◽  
Author(s):  
Jia Liu ◽  
Pinggang Jia ◽  
Huixin Zhang ◽  
Xiaodan Tian ◽  
Hao Liang ◽  
...  
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Pressure Sensor ◽  
Fiber Optic ◽  
Ceramic Technology ◽  
Fabry Perot ◽  
Temperature Applications

Low temperature bonding for high temperature applications by using SnBi solders

2015 ◽  
Vol 647 ◽  
pp. 681-685 ◽  
Author(s):  
T.L. Yang ◽  
J.Y. Wu ◽  
C.C. Li ◽  
S. Yang ◽  
C.R. Kao
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Low Temperature Bonding ◽  
Temperature Applications

scholarly journals Low-Temperature Mullite Formation in Ternary Oxide Coatings Deposited by ALD for High-Temperature Applications

2017 ◽  
Vol 4 (23) ◽  
pp. 1700912 ◽  
Author(s):  
Kaline P. Furlan ◽  
Tobias Krekeler ◽  
Martin Ritter ◽  
Robert Blick ◽  
Gerold A. Schneider ◽  
...  
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Ternary Oxide ◽  
Mullite Formation ◽  
Oxide Coatings ◽  
Temperature Applications

A low temperature die attach technique for high temperature applications based on indium infiltrating micro-porous Ag sheet

2018 ◽  
Vol 29 (21) ◽  
pp. 18302-18310 ◽  
Author(s):  
Xingchi Xie ◽  
Chunjin Hang ◽  
Jianqiang Wang ◽  
Yue Su ◽  
Jie Ma ◽  
...  
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Die Attach ◽  
Temperature Applications

Exsolution and inversion in pigeonite from the Whin Sill, Northern England

1978 ◽  
Vol 36 (1) ◽  
pp. 474-475
Author(s):  
P.P.K. Smith
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Homogeneous Nucleation ◽  
Silicate Mineral ◽  
Antiphase Boundaries ◽  
Two Phase ◽  
Primitive Form ◽  
The Core ◽  
Nucleation Mechanisms ◽  
And Inversion

Grains of pigeonite, a calcium-poor silicate mineral of the pyroxene group, from the Whin Sill dolerite have been ion-thinned and examined by TEM. The pigeonite is strongly zoned chemically from the composition Wo8En64FS28 in the core to Wo13En34FS53 at the rim. Two phase transformations have occurred during the cooling of this pigeonite:- exsolution of augite, a more calcic pyroxene, and inversion of the pigeonite from the high- temperature C face-centred form to the low-temperature primitive form, with the formation of antiphase boundaries (APB's). Different sequences of these exsolution and inversion reactions, together with different nucleation mechanisms of the augite, have created three distinct microstructures depending on the position in the grain.In the core of the grains small platelets of augite about 0.02μm thick have farmed parallel to the (001) plane (Fig. 1). These are thought to have exsolved by homogeneous nucleation. Subsequently the inversion of the pigeonite has led to the creation of APB's.

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