Characterization of Surface Integrity of Ti6Al4V Alloy Machined by Using Wire Electrical Discharge Machining Process

2019 ◽  
Vol 11 ◽  
pp. A8-A14
Author(s):  
Hulas Raj Tonday ◽  
Anand Mukut Tigga
Author(s):  
Sadananda Chakraborty ◽  
Souren Mitra ◽  
Dipankar Bose

Precision machining characteristics with high-dimensional accuracy make the material more adaptable towards the applications. The present study employs the powder mixed wire electrical discharge machining process to machine Ti6Al4V alloy material. In spite of limited drawbacks and enhanced output in the powder mixed wire electrical discharge machining process, the present problem has been formulated for improving the machining efficiency of Ti6Al4V. The impact of suspended powder characteristics on responses, that is, material removal rate and surface roughness, is examined throughout the process. The current investigation also focuses on the interaction effect of machining constraints along with Al2O3 abrasive mixed dielectric to achieve economical machining output for the Ti6Al4V material. An effort has been presented to obtain optimal solutions using the different methodologies, namely response surface methodology, grey relation analysis, and particle swarm optimization. The study reveals that discharge energy is deeply influenced by the peak current and pulse off time followed by powder concentration in the powder mixed wire electrical discharge machining process. The maximum material removal rate of 6.628 mm3/min and average surface finish of 1.386 μm are the outcome of the present study for a set of optimal machining settings, that is, pulse off time ( Toff) of 7.247 μs, pulse on time ( Ton) of 30 μs, peak current ( Ip) of 2 A, and powder concentration of 4 g/L. Finally, the proposed model has been verified that the hybrid particle swarm optimization technique has the highest adequate capability to achieve maximum output. Thus, the approach offered an enhancement on performance measures of Ti6Al4V alloy in the powder mixed wire electrical discharge machining process.


Materials ◽  
2020 ◽  
Vol 13 (3) ◽  
pp. 530 ◽  
Author(s):  
Rakesh Chaudhari ◽  
Jay J. Vora ◽  
Vivek Patel ◽  
L. N. López de Lacalle ◽  
D. M. Parikh

Shape-memory alloys such as nitinol are gaining popularity as advanced materials in the aerospace, medical, and automobile sectors. However, nitinol is a difficult-to-cut material because of its versatile specific properties such as the shape-memory effect, superelasticity, high specific strength, high wear and corrosion resistance, and severe strain hardening. Anunconventional machining process like wire-electrical-discharge-machining (WEDM) can be effectively and efficiently used for the machining of such alloys, although the WEDM-induced surface integrity of nitinol hassignificant impact on material performance. Therefore, this work investigated the surface integrity of WEDM-processed nitinol samples using digital microscopy imaging, scanning electron microscopy (SEM), and energy-dispersive X-ray (EDX) analysis. Three-dimensional analysis of the surfaces was carried out in two different patterns (along the periphery and the vertical plane of the machined surface) andrevealed that surface roughness was maximalat the point where the surface was largely exposed to the WEDM dielectric fluid. To attain the desired surface roughness, appropriate discharge energy is required that, in turn, requires the appropriate parameter settings of the WEDM process. Different SEM image analyses showed a reduction in microcracks and pores, and in globule-density size at optimized parameters. EDX analysis revealed the absence of wire material on the machined surface


Author(s):  
Kamlesh Joshi ◽  
Upendra Bhandarkar ◽  
Indradev Samajdar ◽  
Suhas S. Joshi

Slicing of Si wafers through abrasive processes generates various surface defects on wafers such as cracks and surface contaminations. Also, the processes cause a significant material loss during slicing and subsequent polishing. Recently, efforts are being made to slice very thin wafers, and at the same time understand the thermal and microstructural damage caused due to sparking during wire-electrical discharge machining (wire-EDM). Wire-EDM has shown potential for slicing ultra-thin Si wafers of thickness < 200 μm. This work, therefore, presents an extensive experimental work on characterization of the thermal damage due to sparking during wire-EDM on ultra-thin wafers. The experiments were performed using Response surface methodology (RSM)-based central composite design (CCD). The damage was mainly characterized by scanning electron microscope (SEM), transmission electron microscopy (TEM), and Raman spectroscopy. The average thickness of thermal damage on the wafers was observed to be ∼16 μm. The damage was highly influenced by exposure time of wafer surface with EDM plasma spark. Also, with an increase in diameter of plasma spark, the surface roughness was found to increase. TEM micrographs have confirmed the formation of amorphous Si along with a region of fine grained Si entrapped inside the amorphous matrix. However, there were no signs of other defects like microcracks, twin boundaries, or fracture on the surfaces. Micro-Raman spectroscopy revealed that in order to slice a wafer with minimum residual stresses and very low presence of amorphous phases, it should be sliced at the lowest value of pulse on-time and at the highest value of open voltage (OV).


2015 ◽  
Vol 809-810 ◽  
pp. 393-398
Author(s):  
Gheorghe Bosoancă ◽  
Laurenţiu Slătineanu ◽  
Margareta Coteaţă ◽  
Ana Badanac

Wire electrical discharge machining is nowadays applied by using adequate specialized machine tools. A research problem could refer to a device for wire electrical discharge machining, adaptable on the current computer numerical controlled ram electrical discharge machines. The device could be able to be used in order to develop cutting processes in plate type workpieces. The wire electrical discharge machining process was examined and premises for developing a device for wire electrical discharge machining were formulated. These premises are used in order to develop an ideas diagram able to offer suggestions for the structure of the device. Distinct components necessary in the device structure were identified and taken into consideration, and three distinct versions of the device were defined.


Machines ◽  
2020 ◽  
Vol 8 (4) ◽  
pp. 69
Author(s):  
Laurenţiu Slătineanu ◽  
Oana Dodun ◽  
Margareta Coteaţă ◽  
Gheorghe Nagîţ ◽  
Irina Beşliu Băncescu ◽  
...  

Wire electrical discharge machining has appeared mainly in response to the need for detachment with sufficiently high accuracy of parts of plate-type workpieces. The improvements introduced later allowed the extension of this machining technology to obtain more complex ruled surfaces with increasingly high requirements regarding the quality of the machined surfaces and the productivity of the wire electrical discharge machining process. Therefore, it was normal for researchers to be interested in developing more and more in-depth investigations into the various aspects of wire electrical discharge machining. These studies focused first on improving the machining equipment, wire electrodes, and the devices used to position the clamping of a wire electrode and workpiece. A second objective pursued was determining the most suitable conditions for developing the machining process for certain proper situations. As output parameters, the machining productivity, the accuracy, and roughness of the machined surfaces, the wear of the wire electrode, and the changes generated in the surface layer obtained by machining were taken into account. There is a large number of scientific papers that have addressed issues related to wire electrical discharge machining. The authors aimed to reveal the aspects that characterize the process, phenomena, performances, and evolution trends specific to the wire electrical discharge machining processes, as they result from scientific works published mainly in the last two decades.


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