Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration

2016 ◽  
Vol 149 ◽  
pp. 145-152 ◽  
Author(s):  
Xin Sun ◽  
Runiu Fang ◽  
Yunhui Zhu ◽  
Xiao Zhong ◽  
Yuan Bian ◽  
...  
Keyword(s):  
Transmission Lines ◽  
Electrical Characterization ◽  
3D Integration ◽  
Through Silicon Vias ◽  
Silicon Vias

Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias

2012 ◽  
Vol 22 (5) ◽  
pp. 055021 ◽  
Author(s):  
Pradeep Dixit ◽  
Tapani Vehmas ◽  
Sami Vähänen ◽  
Philippe Monnoyer ◽  
Kimmo Henttinen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Electrical Characterization ◽  
Through Silicon Vias ◽  
Poly Silicon ◽  
Silicon Vias

Experimental characterization of coaxial through silicon vias for 3D integration

2015 ◽  
Vol 46 (5) ◽  
pp. 377-382 ◽  
Author(s):  
Stephen Adamshick ◽  
Douglas Coolbaugh ◽  
Michael Liehr
Keyword(s):  
Experimental Characterization ◽  
3D Integration ◽  
Through Silicon Vias ◽  
Silicon Vias
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