Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

2008 ◽  
Vol 48 (3) ◽  
pp. 416-424 ◽  
Author(s):  
C.J. Hang ◽  
C.Q. Wang ◽  
M. Mayer ◽  
Y.H. Tian ◽  
Y. Zhou ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Isothermal Aging ◽  
Growth Behavior ◽  
Ball Bonds

Formation and Evolution of Intermetallic Compounds in Solder Joint for Electronic Interconnect

2011 ◽  
Vol 687 ◽  
pp. 80-84
Author(s):  
Chang Hua Du ◽  
Hai Jian Zhao ◽  
Li Meng Yin ◽  
Fang Chen
Keyword(s):  
Mechanical Properties ◽  
Solder Joint ◽  
Intermetallic Compounds ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Growth Behavior ◽  
Electronic Products ◽  
Formation And Evolution ◽  
Kirkendall Voids ◽  
Reliability Of Solder Joints

As solder joints become increasingly miniaturized to meet the severe demands of future electronic packaging, the thickness of intermetallic compounds (IMC) in solder joint continuously decreases, while, the IMC proportion to the whole solder joint increases. So IMC plays a more and more important role in the reliability of microelectronic structure and microsystems. In this paper, the formation and growth behavior, along with the composition of IMC at the interface of Sn-based solders/Cu substrate in soldering were reviewed comprehensively. The effect of isothermal aging, thermal-shearing cycling and electromigration on the interfacial IMC growth and evolution were also presented. Furthermore, the formation mechanism of Kirkendall voids during thermal aging was introduced. In addition, the effect of the interfacial IMC on mechanical properties of solder joints was in-depth summarized. Adopting an appropriate flux to control the thickness of the IMC to improve the reliability of solder joints and electronic products was proposed in the end of this paper.

Effect of isothermal aging on the growth behavior of Cu/Al intermetallic compounds

2014 ◽  
Author(s):  
Omid Mokhtari ◽  
Min-Su Kim ◽  
Hiroshi Nishikawa ◽  
Fumiyoshi Kawashiro ◽  
Satoshi Itou ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Isothermal Aging ◽  
Growth Behavior

scholarly journals Investigation of Formation and Growth Behavior of Cu/Al Intermetallic Compounds during Isothermal Aging

2014 ◽  
Vol 7 (1) ◽  
pp. 1-7 ◽  
Author(s):  
Omid Mokhtari ◽  
Min-Su Kim ◽  
Hiroshi Nishikawa ◽  
Fumiyoshi Kawashiro ◽  
Satoshi Itoh ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Isothermal Aging ◽  
Growth Behavior
Sign in / Sign up

Export Citation Format

Share Document