Impact of load pulse duration on power cycling lifetime of chip interconnection solder joints

Microelectronics Reliability ◽

10.1016/j.microrel.2017.06.081 ◽

2017 ◽

Vol 76-77 ◽

pp. 480-484 ◽

Author(s):

M. Junghaenel ◽

U. Scheuermann

Keyword(s):

Pulse Duration ◽

Solder Joints ◽

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Impact of load pulse duration on failure mechanism of high power IGBT modules under power cycling condition

The 16th IET International Conference on AC and DC Power Transmission (ACDC 2020) ◽

10.1049/icp.2020.0123 ◽

2021 ◽

Author(s):

J. Chen ◽

E. Deng ◽

L. Xie ◽

Z. Zhao ◽

Y. Wu ◽

...

Keyword(s):

Failure Mechanism ◽

Pulse Duration ◽

Igbt Modules ◽

Power Cycling ◽

Cycling Condition

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Impact of load pulse duration on power cycling lifetime of Al wire bonds

Microelectronics Reliability ◽

10.1016/j.microrel.2013.06.019 ◽

2013 ◽

Vol 53 (9-11) ◽

pp. 1687-1691 ◽

Author(s):

U. Scheuermann ◽

R. Schmidt

Keyword(s):

Pulse Duration ◽

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Power cycling capability of high power IGBT modules with focus on short load pulse duration

2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD) ◽

10.23919/ispsd.2017.7988971 ◽

2017 ◽

Author(s):

Guang Zeng ◽

Yijun Ye ◽

Josef Lutz ◽

Rodrigo Alvarez ◽

Pablo Correa

Keyword(s):

Pulse Duration ◽

Igbt Modules ◽

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Failure Mechanism of Die-Attach Solder Joints in IGBT Modules Under Pulse High-Current Power Cycling

IEEE Journal of Emerging and Selected Topics in Power Electronics ◽

10.1109/jestpe.2018.2871474 ◽

2019 ◽

Vol 7 (1) ◽

pp. 99-107 ◽

Author(s):

Yongle Huang ◽

Yifei Luo ◽

Fei Xiao ◽

Binli Liu

Keyword(s):

Failure Mechanism ◽

Solder Joints ◽

High Current ◽

Igbt Modules ◽

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Fatigue life of leadless chip carrier solder joints during power cycling

Microelectronics Journal ◽

10.1016/s0026-2692(85)80029-x ◽

1985 ◽

Vol 16 (5) ◽

pp. 49

Keyword(s):

Fatigue Life ◽

Solder Joints ◽

Power Cycling ◽

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Thermo-mechanical damage accumulation during power cycling of lead-free surface mount solder joints

2008 2nd Electronics Systemintegration Technology Conference ◽

10.1109/estc.2008.4684502 ◽

2008 ◽

Author(s):

P. Hegde ◽

D.C. Whalley ◽

V.V. Silberschmidt

Keyword(s):

Free Surface ◽

Damage Accumulation ◽

Solder Joints ◽

Mechanical Damage ◽

Lead Free ◽

Surface Mount ◽

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A Discussion on the Methods of Thermal Cycling and Power Cycling for Reliability Prediction of Solder Joints of Electronic Components

10.4271/2015-36-0553 ◽

2015 ◽

Author(s):

Alirio Cavalcanti de Brito ◽

Marcelo Lopes de Oliveira e Souza

Keyword(s):

Thermal Cycling ◽

Solder Joints ◽

Reliability Prediction ◽

Electronic Components ◽

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Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/tchmt.1983.1136183 ◽

1983 ◽

Vol 6 (3) ◽

pp. 232-237 ◽

Author(s):

W. Engelmaier

Keyword(s):

Fatigue Life ◽

Solder Joints ◽

Power Cycling ◽

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Field Condition Reliability Assessment for SnPb and SnAgCu Solder Joints in Power Cycling Including Mini Cycles

56th Electronic Components and Technology Conference 2006 ◽

10.1109/ectc.2006.1645762 ◽

2006 ◽

Author(s):

Min Pei ◽

Xuejun Fan ◽

P.K. Bhatti

Keyword(s):

Field Condition ◽

Solder Joints ◽

Reliability Assessment ◽

Snagcu Solder ◽

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Power cycling thermal fatigue of Sn–Pb solder joints on a chip scale package

International Journal of Fatigue ◽

10.1016/j.ijfatigue.2003.09.004 ◽

2004 ◽

Vol 26 (5) ◽

pp. 497-510 ◽

Author(s):

P Towashiraporn

Keyword(s):

Thermal Fatigue ◽

Solder Joints ◽

Power Cycling ◽

Chip Scale Package

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