High-temperature shear strength of lead-free Sn–Sb–Ag/Al2O3 composite solder

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

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Composition Analysis of Asphalt Mixture High Temperature Shear Strength

ICCTP 2011 ◽

10.1061/41186(421)337 ◽

2011 ◽

Author(s):

Jing Tao ◽

Bo Yang ◽

Hui-xian Zhang

Keyword(s):

Shear Strength ◽

High Temperature ◽

Asphalt Mixture ◽

Composition Analysis ◽

Temperature Shear

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High Temperature Bonding Effect of the Room-Temperature-Curing Phosphate Adhesive for C/C Composites

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.680.179 ◽

2016 ◽

Vol 680 ◽

pp. 179-183 ◽

Cited By ~ 2

Author(s):

Ming Chao Wang ◽

Meng Meng Zhuang ◽

Xin Tao ◽

Xi Qing Xu ◽

Hai Tao Geng ◽

...

Keyword(s):

Shear Strength ◽

High Temperature ◽

Thermal Cycling ◽

Bonding Strength ◽

Room Temperature ◽

Temperature Range ◽

Heat Resistant ◽

Bonding Effect ◽

Temperature Shear

A heat-resistant phosphate adhesive was developed for joining and repairing of C/C composites. The high-temperature bonding effect for both cured adhesive and 1300°C-calcined adhesive had been evaluated through testing high-temperature shear strength of corresponding joints. The results showed that the bonding strength of cured adhesive decreased from 7.9 MPa at RT to 0.9 MPa at 1300°C, while that of 1300°C-calcined adhesive could maintain about 4 MPa at temperature range from RT to 700°C and then decreased to 1.7 MPa at 1300°C. Besides, with the increasing thermal cycling times at 1300°C, the high-temperature bonding strength at this temperature could maintain at about 2.3 MPa.

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Reliability and Corrosion Resistance of High Temperature Lead-Free BiAgX™ Paste

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/hitec-tha24 ◽

2014 ◽

Vol 2014 (HITEC) ◽

pp. 000347-000354 ◽

Cited By ~ 2

Author(s):

HongWen Zhang ◽

RunSheng Mao ◽

Ning-Cheng Lee ◽

Satoshi Tanimoto

Keyword(s):

Corrosion Resistance ◽

Shear Strength ◽

High Temperature ◽

Salt Water ◽

Lead Free ◽

Water Spray ◽

Bond Shear Strength ◽

Die Attach ◽

Increasing Temperature ◽

Average Bond

The BiAgX™ paste, designed for die attach application, composed of the majority of BiAg powders (melting point >260°C) and the minority of additive powders. The additive powders are dominating the interfacial reaction to improve the wetting of the paste on various commonly-used surface finish materials. After reflow, the joint shows the above 260°C remelting temperature. The average bond shear strength of BiAgX joint between SiC die and AMBC-SiN substrate (Package A) decreases from 54MPa to 16MPa with increasing temperature from RT to 250°C. Upon thermal storage at 200°C or 230°C for 3000hrs, the bond shear strength decreases from 54MPa to 38MPa and 21MPa, respectively. Upon thermal cycling from −55°C to 125°C for 2000cycles and thermal shock from −55°C to 150°C for 2000cycles, BiAgX outperforms Pb5Sn2.5Sn (Package B). BiAgX also show the better corrosion resistance than SAC305 and Pb5Sn2.5Ag under 96hrs salt water spray (SWS) tests.

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