Microstructure and elevated-temperature shear strength of Zn–4Al–3Mg–xSn high-temperature lead-free solders

2014 ◽  
Vol 54 (8) ◽  
pp. 1592-1597 ◽  
Author(s):  
R. Mahmudi ◽  
D. Farasheh
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Elevated Temperature ◽  
Lead Free ◽  
Temperature Shear ◽  
Lead Free Solders

scholarly journals High-temperature shear strength and hardness of cast lead-free solders

2017 ◽  
Vol 55 (03) ◽  
pp. 211-216 ◽  
Author(s):  
R. MAHMUDI ◽  
A. MARAGHI ◽  
A. R. GERANMAYEH
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Temperature Shear ◽  
Lead Free Solders

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

High-temperature shear strength of lead-free Sn–Sb–Ag/Al2O3 composite solder

2011 ◽  
Vol 528 (12) ◽  
pp. 3967-3972 ◽  
Author(s):  
A.R. Geranmayeh ◽  
R. Mahmudi ◽  
M. Kangooie
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Composite Solder ◽  
Lead Free ◽  
Al2o3 Composite ◽  
Temperature Shear

scholarly journals Reliability of High Temperature and Vibration in Sn3.5Ag and Sn0.7Cu Lead-free Solders

2012 ◽  
Vol 19 (3) ◽  
pp. 31-36 ◽  
Author(s):  
Yong-Ho Ko ◽  
Taek-Soo Kim ◽  
Young-Kyu Lee ◽  
Sehoo Yoo ◽  
Chang-Woo Lee
Keyword(s):  
High Temperature ◽  
Lead Free ◽  
Lead Free Solders

Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates

2009 ◽  
Vol 38 (6) ◽  
pp. 873-883 ◽  
Author(s):  
Seongjun Kim ◽  
Keun-Soo Kim ◽  
Katsuaki Suganuma ◽  
Goro Izuta
Keyword(s):  
High Temperature ◽  
Interfacial Reactions ◽  
Lead Free ◽  
Die Attachment ◽  
Cu Substrates ◽  
Lead Free Solders

High Temperature Bonding Effect of the Room-Temperature-Curing Phosphate Adhesive for C/C Composites

2016 ◽  
Vol 680 ◽  
pp. 179-183 ◽  
Author(s):  
Ming Chao Wang ◽  
Meng Meng Zhuang ◽  
Xin Tao ◽  
Xi Qing Xu ◽  
Hai Tao Geng ◽  
...  
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Thermal Cycling ◽  
Bonding Strength ◽  
Room Temperature ◽  
Temperature Range ◽  
Heat Resistant ◽  
Bonding Effect ◽  
Temperature Shear

A heat-resistant phosphate adhesive was developed for joining and repairing of C/C composites. The high-temperature bonding effect for both cured adhesive and 1300°C-calcined adhesive had been evaluated through testing high-temperature shear strength of corresponding joints. The results showed that the bonding strength of cured adhesive decreased from 7.9 MPa at RT to 0.9 MPa at 1300°C, while that of 1300°C-calcined adhesive could maintain about 4 MPa at temperature range from RT to 700°C and then decreased to 1.7 MPa at 1300°C. Besides, with the increasing thermal cycling times at 1300°C, the high-temperature bonding strength at this temperature could maintain at about 2.3 MPa.

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