Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

2016 ◽  
Vol 673 ◽  
pp. 167-177 ◽  
Author(s):  
Xiaowu Hu ◽  
Tao Xu ◽  
Leon M. Keer ◽  
Yulong Li ◽  
Xiongxin Jiang
Keyword(s):  
Microstructure Evolution ◽  
Fracture Behavior ◽  
Solder Joints ◽  
Shear Fracture

Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test

2010 ◽  
Vol 25 (7) ◽  
pp. 1312-1320 ◽  
Author(s):  
Y.L. Huang ◽  
K.L. Lin ◽  
D.S. Liu
Keyword(s):  
Fracture Energy ◽  
Microstructure Evolution ◽  
Thermal Cycle ◽  
Fracture Behavior ◽  
Solder Ball ◽  
Solder Joints ◽  
Whisker Formation ◽  
Structural Variations ◽  
Before And After ◽  
Ball Joints

The microstructure and microimpact performance of Sn1Ag0.1Cu0.02Ni0.05In (SAC101NiIn)/AuNi/Cu solder ball joints were investigated after a thermal cycle test (TCT). The joints show complete bulk fracture behavior before TCT. Moreover, TCT facilitated interfacial fracture behavior with lower fracture energy. The intermetallic compounds (IMCs) formed in the solder joints before and after TCT were investigated. TCT induces a variety of structural variations in the solder joints, including slipping bands, whisker formation, the squeezing of the IMC layer, the formation of cavities, the rotation and pop-up of grain, and the deformation and rotation of the entire joint. The variations in fracture behavior induced by TCT are correlated with the structural variations in the solder joints.

VOLUME EFFECT OF SHEAR FRACTURE BEHAVIOR OF Sn3.0Ag0.5Cu/Cu LEAD--FREE SOLDER JOINTS

2010 ◽  
Vol 46 (3) ◽  
pp. 366-371 ◽  
Author(s):  
Yanhong TIAN ◽  
Shihua YANG ◽  
Chunqing WANG ◽  
Xuelin WANG ◽  
Pengrong LIN
Keyword(s):  
Fracture Behavior ◽  
Solder Joints ◽  
Shear Fracture ◽  
Volume Effect ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Microstructure Evolution and Mechanical Properties of the Ni/Ni Soldered Joints

2011 ◽  
Vol 172-174 ◽  
pp. 863-868
Author(s):  
Anna Sypień ◽  
Andrzej Piątkowski ◽  
Paweł Zięba
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Chemical Composition ◽  
Microstructure Evolution ◽  
Fracture Behavior ◽  
Bulk Solder ◽  
Subsequent Aging ◽  
Brittle Phase ◽  
Edx Microanalysis ◽  
Solder Interface

The paper presents the results of studies on the microstructure, chemical composition and mechanical properties of the Ni/SnAuCu/Ni interconnections obtained due to the conventional soldering at 300 °C for different times and subsequent aging at 150 °C. The EDX microanalysis allowed to detect at the Ni/solder interface the (Ni,Cu,Au)3Sn4phase which transformed to (Cu,Ni,Au)6Sn5after longer time of soldering. In the central part of the interconnection AuSn4brittle phase was present. This phase was responsible for the significant decrease of the shear strength in the joints subjected to aging at 150 °C for 1000h, 1500 hours. The fracture behavior of such joints appeared to be caused partly by the coalescence of the microvoids in the bulk solder, cleavage of η-phase grains and decohesion at the interface.

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