Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects

2011 ◽  
Vol 40 (12) ◽  
pp. 2425-2435 ◽  
Author(s):  
X. P. Li ◽  
J. M. Xia ◽  
M. B. Zhou ◽  
X. Ma ◽  
X. P. Zhang
Keyword(s):  
Microstructure Evolution ◽  
Fracture Behavior ◽  
Shear Fracture ◽  
Ball Grid Array ◽  
Solder Interconnects ◽  
Solder Volume ◽  
Array Structure ◽  
Volume Effects

Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

2016 ◽  
Vol 673 ◽  
pp. 167-177 ◽  
Author(s):  
Xiaowu Hu ◽  
Tao Xu ◽  
Leon M. Keer ◽  
Yulong Li ◽  
Xiongxin Jiang
Keyword(s):  
Microstructure Evolution ◽  
Fracture Behavior ◽  
Solder Joints ◽  
Shear Fracture

Microstructure Evolution and Mechanical Properties of the Ni/Ni Soldered Joints

2011 ◽  
Vol 172-174 ◽  
pp. 863-868
Author(s):  
Anna Sypień ◽  
Andrzej Piątkowski ◽  
Paweł Zięba
Keyword(s):  
Mechanical Properties ◽  
Shear Strength ◽  
Chemical Composition ◽  
Microstructure Evolution ◽  
Fracture Behavior ◽  
Bulk Solder ◽  
Subsequent Aging ◽  
Brittle Phase ◽  
Edx Microanalysis ◽  
Solder Interface

The paper presents the results of studies on the microstructure, chemical composition and mechanical properties of the Ni/SnAuCu/Ni interconnections obtained due to the conventional soldering at 300 °C for different times and subsequent aging at 150 °C. The EDX microanalysis allowed to detect at the Ni/solder interface the (Ni,Cu,Au)3Sn4phase which transformed to (Cu,Ni,Au)6Sn5after longer time of soldering. In the central part of the interconnection AuSn4brittle phase was present. This phase was responsible for the significant decrease of the shear strength in the joints subjected to aging at 150 °C for 1000h, 1500 hours. The fracture behavior of such joints appeared to be caused partly by the coalescence of the microvoids in the bulk solder, cleavage of η-phase grains and decohesion at the interface.

Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test

2010 ◽  
Vol 25 (7) ◽  
pp. 1312-1320 ◽  
Author(s):  
Y.L. Huang ◽  
K.L. Lin ◽  
D.S. Liu
Keyword(s):  
Fracture Energy ◽  
Microstructure Evolution ◽  
Thermal Cycle ◽  
Fracture Behavior ◽  
Solder Ball ◽  
Solder Joints ◽  
Whisker Formation ◽  
Structural Variations ◽  
Before And After ◽  
Ball Joints

The microstructure and microimpact performance of Sn1Ag0.1Cu0.02Ni0.05In (SAC101NiIn)/AuNi/Cu solder ball joints were investigated after a thermal cycle test (TCT). The joints show complete bulk fracture behavior before TCT. Moreover, TCT facilitated interfacial fracture behavior with lower fracture energy. The intermetallic compounds (IMCs) formed in the solder joints before and after TCT were investigated. TCT induces a variety of structural variations in the solder joints, including slipping bands, whisker formation, the squeezing of the IMC layer, the formation of cavities, the rotation and pop-up of grain, and the deformation and rotation of the entire joint. The variations in fracture behavior induced by TCT are correlated with the structural variations in the solder joints.

Effect of Volume on Ceramic Ball-Grid Array Solder Life

1999 ◽  
Author(s):  
Stephen A. McKeown ◽  
Chittaranjan Sahay
Keyword(s):  
Finite Element ◽  
Thermal Cycle ◽  
Ball Grid Array ◽  
Element Analysis ◽  
Ceramic Ball ◽  
Strain Concentration ◽  
Linear Finite Element ◽  
Solder Volume ◽  
Plastic Analysis ◽  
Initial Results

Abstract Paper describes the effect of solder volume on solder life based on linear finite element analysis using ANSYS. The results indicate an optimal volume for the solder life. Any increase or decrease in the solder volume from the optimum volume decreases the fatigue life of solder joints. Solder joint life was also experimentally determined for the same temperature excursion with a 2-hour thermal cycle. The experimental results compare well with the results estimated by finite element modeling. Studies for one elastic-plastic analysis has also been carried out. Initial results indicate substantial increase in strain concentration factor.

Impact of isothermal aging on fine pitch BGA packages with Sn-Ag-Cu solder interconnects

2010 ◽  
Vol 2010 (1) ◽  
pp. 000298-000305
Author(s):  
Tae-Kyu Lee ◽  
Weidong Xie ◽  
Thomas R. Bieler ◽  
Kuo-Chuan Liu ◽  
Jie Xue
Keyword(s):  
Thermal Cycling ◽  
Microstructure Evolution ◽  
Isothermal Aging ◽  
Substrate Surface ◽  
Solder Interconnects ◽  
Surface Finishes ◽  
Bga Packages ◽  
Fine Pitch ◽  
Solder Balls

The interaction between isothermal aging and long-term reliability of fine pitch ball grid array (BGA) packages with Sn-3.0Ag-0.5Cu (wt%) solder ball interconnects are investigated. In this study, 0.4mm fine pitch packages with 0.3mm diameter Sn-Ag-Cu solder balls are used. Two different die sizes and two different package substrate surface finishes are selected to compare the internal strain impact and alloy effect, especially the Ni effect during thermal cycling. To see the thermal impact on the thermal performance and long-term reliability, the samples are isothermally aged and thermal cycled from 0 to 100°C with a 10minute dwell time. Based on weibull plots for each aging condition, the lifetime of the package reduced approximately 44% with 150°C aging precondition. The microstructure evolution is observed during thermal aging and thermal cycling with different phase microstructure transformations between electrolytic Ni/Au and OSP surface finishes, focusing on the microstructure evolution near the package side interface. Different mechanisms after aging at various conditions are observed, and their impacts on the fatigue life of solder joints are discussed.

scholarly journals Microstructure and Fracture Behavior of Refill Friction Stir Spot Welded Joints of AA2024 Using a Novel Refill Technique

Metals ◽  
2019 ◽  
Vol 9 (3) ◽  
pp. 286 ◽  
Author(s):  
Lipeng Deng ◽  
Shuhan Li ◽  
Liming Ke ◽  
Jinhe Liu ◽  
Jidong Kang
Keyword(s):  
Spot Welding ◽  
Fracture Behavior ◽  
Shear Fracture ◽  
Load Capacity ◽  
Maximum Load ◽  
Fusion Welding ◽  
Tensile Shear ◽  
Friction Stir ◽  
Corona Ring ◽  
Spot Welded

Keyhole at the end of a conventional friction stir welded (FSW) joint is one of the major concerns in certain applications. To address this issue, a novel keyhole refilling technique was developed for conventional friction stir spot welding (FSSW) using resistance spot welding (RSW). A three-phase secondary rectifier resistance welder was adapted for the refill of the keyhole in the 1.5 mm + 1.5 mm friction stir spot welded 2024-T4 aluminum alloy joint. The microstructure and tensile shear fracture behavior were compared for both the unfilled and refilled specimens. The results show that the plug and keyhole are dominated by solid state welding with some localized zones by fusion welding. The refill process significantly improved the maximum load capacity in tensile shear testing as the corona ring is enlarged leading to a larger bonding area. Moreover, the tensile shear fracture occurs in the refilled FSSW specimens at the corona bonding zone, while the fracture occurs at the hook zone in the unfilled keyhole.

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