Hole mobility in Strained Si/Relaxed SiGe/Si(110) hetero structures studied by gated Hall measurements

2020 ◽  
Vol 113 ◽  
pp. 105052
Author(s):  
Daichi Namiuchi ◽  
Atsushi Onogawa ◽  
Taisuke Fujisawa ◽  
Yuichi Sano ◽  
Daisuke Izumi ◽  
...  
2019 ◽  
Author(s):  
K. Arimoto ◽  
N. Utsuyama ◽  
S. Mitsui ◽  
K. Satoh ◽  
T. Yamada ◽  
...  
Keyword(s):  

2009 ◽  
Vol 30 (10) ◽  
pp. 104001 ◽  
Author(s):  
Zhao Shuo ◽  
Guo Lei ◽  
Wang Jing ◽  
Xu Jun ◽  
Liu Zhihong

2011 ◽  
Vol 181-182 ◽  
pp. 388-392
Author(s):  
Jian Jun Song ◽  
Shuai Lei ◽  
He Ming Zhang ◽  
Hui Yong Hu

Applying KP theory combined with deformation potential we obtained the valence band structure, and based on this result we calculated the orientation-dependent effective mass which is also called conductivity effective mass in strained Si1-xGex/(001)Si in this research, and furthermore ,we established the scattering rate model by using the density-of-states effective mass. On the basis of conductivity effective mass and scattering rate model, utilizing analytical method and relaxation time approximation we obtained the dependence of the value of hole mobility on stress and doping concentration in strained Si1-xGex/(001)Si along different crystal orientations. Compare to the unstrained Si, the anisotropy of hole mobility is more obvious in strained Si1-xGex/(001)Si, for example, It shows that under the same stress and doping concentration (Ni=1x1014cm-3, x=0.4), the value of hole mobility along [010] crystal orientation is visibly higher than other crystal orientations. This result can provide valuable references to the research of hole mobility of strained Si1-xGex materials and the design of devices.


2004 ◽  
Vol 809 ◽  
Author(s):  
B. Ghyselen ◽  
Y. Bogumilowicz ◽  
C. Aulnette ◽  
A. Abbadie ◽  
B. Osternaud ◽  
...  

ABSTRACTStrained Silicon On Insulator wafers are today envisioned as a natural and powerfulenhancement to standard SOI and/or bulk-like strained Si layers. For MOSFETs applications, thisnew technology potentially combines enhanced devices scalability allowed by thin films andenhanced electron and hole mobility in strained silicon. This paper is intended to demonstrate byexperimental results how a layer transfer technique such as the Smart Cut™ technology can be usedto obtain good quality tensile Strained Silicon On insulator wafers. Detailed experiments andcharacterizations will be used to characterize these engineered substrates and show that they arecompatible with the applications.


2007 ◽  
Vol 54 (6) ◽  
pp. 1394-1401 ◽  
Author(s):  
Qiuxia Xu ◽  
Xiaofeng Duan ◽  
Haihua Liu ◽  
Zhengsheng Han ◽  
Tianchun Ye

2001 ◽  
Vol 79 (25) ◽  
pp. 4246-4248 ◽  
Author(s):  
C. W. Leitz ◽  
M. T. Currie ◽  
M. L. Lee ◽  
Z.-Y. Cheng ◽  
D. A. Antoniadis ◽  
...  

1999 ◽  
Vol 06 (01) ◽  
pp. 7-12 ◽  
Author(s):  
N. G. GALKIN ◽  
D. L. GOROSHKO ◽  
A. V. KONCHENKO ◽  
V. A. IVANOV ◽  
A. S. GOURALNIK

The first in situ Hall measurements of the ordered chromium surface phases on Si(111) substrate and CrSi(111) epitaxial films after their formation are presented. Formation of Si (111)-(1× 1)- Cr (0.1 nm Cr) and Si(111)-[([Formula: see text])/30°]-Cr (0.3 nm Cr) surface phases results in an increase in the sheet resistivity of Si(111)-Cr surface phase samples. The conductivities along the surface phases at these chromium thicknesses are very low. The conductivity decrease is caused by a decrease in the electron mobility in the surface phase layers. Formation of an epitaxial CrSi(111) layer with averaged Hall parameters (hole mobility of 440 cm 2· V -1· s -1, sheet resistivity of 2.2·104 Ω-1 and sheet hole concentration of 0.65·1012 cm -2) has been observed at 1.5–1.8 nm of chromium thickness.


2000 ◽  
Vol 21 (5) ◽  
pp. 230-232 ◽  
Author(s):  
T. Mizuno ◽  
S. Takagi ◽  
N. Sugiyama ◽  
H. Satake ◽  
A. Kurobe ◽  
...  
Keyword(s):  

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