Film formation and mechanical properties of the alkoxysilane-functionalized poly (styrene-co-butyl acrylate) latex prepared by miniemulsion copolymerization

2009 ◽  
Vol 65 (1) ◽  
pp. 56-61 ◽  
Author(s):  
Sheng Wen Zhang ◽  
Ren Liu ◽  
Jin Qiang Jiang ◽  
Hui Yu Bai
2003 ◽  
Vol 36 (15) ◽  
pp. 5804-5814 ◽  
Author(s):  
Jung Kwon Oh ◽  
Pablo Tomba ◽  
Xiaodong Ye ◽  
Richard Eley ◽  
Jude Rademacher ◽  
...  

2012 ◽  
Vol 75 (1-2) ◽  
pp. 86-91 ◽  
Author(s):  
José Manuel Ramos-Fernández ◽  
Irene Beleña ◽  
María Dolores Romero-Sánchez ◽  
Monica Fuensanta ◽  
Celia Guillem ◽  
...  

Polymers ◽  
2021 ◽  
Vol 13 (7) ◽  
pp. 1129
Author(s):  
Bo-Young Lee ◽  
Dae-Hyeon Lee ◽  
Keon-Soo Jang

Epoxy resins with acidic compounds feature adhesion, robustness, and deoxidizing ability. In this study, hybrid adhesive films with deoxidizing and curing capabilities for semiconductor packaging were fabricated. The compatibilizing effects and mechanical properties were chiefly investigated by using various additive binders (thermoplastic amorphous polymers) and compatibilizing agents. The curing, deoxidizing, thermal, and rheological properties were systematically investigated. For uniform film formation and maximizing deoxidizing curable abilities, a thermoplastic--thermoset mixture containing a phenyl and carboxylic acid-based additive (benzoic acid), and a polycarbonate was chosen as the model adhesive film. Without either a phenyl or an acidic group in the compatibilizing agent, deoxidizing and compatibilizing effects were not achieved. The manufactured hybrid adhesive film can be effectively used, especially for electronic devices that require deoxidization and adhesion.


Author(s):  
S Mohan Kumar ◽  
R Sasikumar ◽  
A Rajesh Kannan ◽  
R Pramod ◽  
N Pravin Kumar ◽  
...  

Wire plus arc additive manufacturing (WAAM) technology with higher deposition rate and efficient material utilization was employed to fabricate a stainless steel 321 (SS 321) wall for the first time. In this work, the microstructural characteristics, mechanical properties and corrosion performance of as-built SS 321 were evaluated. The micrographs confirmed the presence of columnar and equiaxed dendrites along the building direction, and recrystallization of grains was noticed due to the re-melting of former layers. The microstructure was dominantly austenite with a small fraction of ferrite within the austenitic matrix. Better tensile properties were noticed for as-printed SS 321 WAAM samples in-comparison to wrought counterpart. This is corroborated to the equiaxed and columnar dendritic microstructure with small fraction of ferrite (FN). The hardness decreased from bottom (247 HV) to top (196 HV) region in SS 321 WAAM plate and is attributed to the microstructural difference with varying amount of ferrite (6.3 to 3.7 FN). The impact strength of samples in the horizontal and vertical direction was 116  ±  2 J and 114  ±  2.5 J respectively, and is comparable with the wrought AISI 321 (123  ±  1.5 J). The reduction in impact toughness is attributed to the ferrite (<6.3 FN) fraction. Polarization curves and Nyquist plots elucidate the excellent pitting resistance of SS 321 WAAM specimens, and the corrosion rate was less than 1 mils per year (mpy). Corrosion cracks were absent, and the passive film formation in the WAAM specimens were compact and highly stable for corrosive environments.


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