Impact Modifiers and Compatibilizers for Versatile Epoxy-Based Adhesive Films with Curing and Deoxidizing Capabilities

Epoxy resins with acidic compounds feature adhesion, robustness, and deoxidizing ability. In this study, hybrid adhesive films with deoxidizing and curing capabilities for semiconductor packaging were fabricated. The compatibilizing effects and mechanical properties were chiefly investigated by using various additive binders (thermoplastic amorphous polymers) and compatibilizing agents. The curing, deoxidizing, thermal, and rheological properties were systematically investigated. For uniform film formation and maximizing deoxidizing curable abilities, a thermoplastic--thermoset mixture containing a phenyl and carboxylic acid-based additive (benzoic acid), and a polycarbonate was chosen as the model adhesive film. Without either a phenyl or an acidic group in the compatibilizing agent, deoxidizing and compatibilizing effects were not achieved. The manufactured hybrid adhesive film can be effectively used, especially for electronic devices that require deoxidization and adhesion.

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On the Mechanical Properties of a Poly(oxazolidone) Polymer for Encapsulant Applications

MRS Proceedings ◽

10.1557/proc-515-209 ◽

1998 ◽

Vol 515 ◽

Author(s):

M. Manoharan ◽

K. S. Chian

Keyword(s):

Mechanical Properties ◽

Thermal Expansion ◽

Glass Transition ◽

Epoxy Resins ◽

Damage Tolerance ◽

Electronic Devices ◽

Diglycidyl Ether ◽

Neutral Axis ◽

High Glass Transition Temperature ◽

Thermal And Electrical Properties

ABSTRACTEpoxy based resins have been widely used as encapsulation materials in microelectronics components due to their good mechanical, thermal and electrical properties, outstanding adhesion to various substrates and the ability to be processed under a variety of conditions. These epoxy resins have a high glass transition temperature but low toughness and damage tolerance. As electronic devices continue to be miniaturized and the scale of integration increases, the encapsulation of these chips leads to mechanical and thermal stress related failures. Mechanical stresses could result from the mismatch in thermal expansion rates between the polymeric encapsulant, the silicon chip and the metal leadframe. The accommodation of these stresses may lead to cracking of the encapsulant or delamination. In this study, poly(oxazolidone) polymer was prepared by reacting 4,4′-Diphenyl-methanediisocyanate (MDI) with diglycidyl ether of bisphenol A (DGEBA) at elevated temperature. The mechanical properties of this polymer were investigated both as a stand-alone material as well as a bi-material sandwich with a brittle substrate. The degree of cracking in the substrate is shown to be a function of the thickness of the polymer layer. This result is analyzed based on the variation in the position of the neutral axis in this composite.

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Application of epoxy resins in electronics and optoelectronics. Part I. Mechanical properties and thermal stability of epoxy resins used for encapsulation of electronic devices

Polimery ◽

10.14314/polimery.2004.233 ◽

2004 ◽

Vol 49 (04) ◽

pp. 233-239

Author(s):

WOJCIECH MAZELA ◽

PIOTR CZUB ◽

JAN PIELICHOWSKI

Keyword(s):

Mechanical Properties ◽

Thermal Stability ◽

Epoxy Resins ◽

Electronic Devices ◽

Thermal Stability Of

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The Mechanical Properties of Organic Modified Epoxy Resin

The Annals of “Dunarea de Jos” University of Galati. Fascicle IX, Metallurgy and Materials Science ◽

10.35219/mms.2020.3.02 ◽

2020 ◽

Vol 43 (3) ◽

pp. 10-14

Author(s):

Georgel MIHU ◽

Claudia Veronica UNGUREANU ◽

Vasile BRIA ◽

Marina BUNEA ◽

Rodica CHIHAI PEȚU ◽

...

Keyword(s):

Mechanical Properties ◽

Composite Materials ◽

Epoxy Resin ◽

Epoxy Matrix ◽

Epoxy Resins ◽

Mechanical Tests ◽

Organic Modification ◽

Three Point Bending ◽

Modified Epoxy

Epoxy resins have been presenting a lot of scientific and technical interests and organic modified epoxy resins have recently receiving a great deal of attention. For obtaining the composite materials with good mechanical proprieties, a large variety of organic modification agents were used. For this study gluten and gelatin had been used as modifying agents thinking that their dispersion inside the polymer could increase the polymer biocompatibility. Equal amounts of the proteins were milled together and the obtained compound was used to form 1 to 5% weight ratios organic agents modified epoxy materials. To highlight the effect of these proteins in epoxy matrix mechanical tests as three-point bending and compression were performed.

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Facile synthesis of a novel zinc-triazole complex for simultaneous improvement in fire safety and mechanical properties of epoxy resins

Composites Part A Applied Science and Manufacturing ◽

10.1016/j.compositesa.2021.106284 ◽

2021 ◽

Vol 143 ◽

pp. 106284

Author(s):

Hafezeh Nabipour ◽

Xin Wang ◽

Lei Song ◽

Yuan Hu

Keyword(s):

Mechanical Properties ◽

Fire Safety ◽

Epoxy Resins ◽

Facile Synthesis ◽

In Fire

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Effect of free-volume holes on static mechanical properties of epoxy resins studied by positron annihilation and PVT experiments

Polymer ◽

10.1016/j.polymer.2020.122225 ◽

2020 ◽

Vol 190 ◽

pp. 122225 ◽

Cited By ~ 1

Author(s):

H.J. Zhang ◽

S. Sellaiyan ◽

K. Sako ◽

A. Uedono ◽

Y. Taniguchi ◽

...

Keyword(s):

Mechanical Properties ◽

Positron Annihilation ◽

Free Volume ◽

Epoxy Resins ◽

Static Mechanical ◽

Static Mechanical Properties

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Engineering Plastics-Recent Developments in Synthesis and Applications. Effect of the Chemical Structure of Phenolic Curing Agents on the Network Structure and Mechanical Properties of Cured Epoxy Resins Containing a Mesogenic Group.

KOBUNSHI RONBUNSHU ◽

10.1295/koron.54.217 ◽

1997 ◽

Vol 54 (4) ◽

pp. 217-223 ◽

Cited By ~ 1

Author(s):

Mitsukazu OCHI ◽

Shinji YOSHINAKA ◽

Yoshihiro SHIMIZU

Keyword(s):

Mechanical Properties ◽

Network Structure ◽

Epoxy Resins ◽

Chemical Structure ◽

Mesogenic Group ◽

Engineering Plastics ◽

Recent Developments ◽

Curing Agents

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Application and Study of Reactive Polyacrylate Microgel in Pigment Paint of Printed Fabric

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.311-313.1044 ◽

2011 ◽

Vol 311-313 ◽

pp. 1044-1048

Author(s):

Hong Long Xing ◽

Shui Lin Chen

Keyword(s):

Electron Microscopy ◽

Mechanical Properties ◽

Transmission Electron Microscopy ◽

Sodium Dodecyl ◽

Ammonium Persulfate ◽

Color Fastness ◽

Adhesive Film ◽

Transmission Electron ◽

Divinyl Benzene

Polyacrylate microgel emulsion was prepared by emulsion polymerization using styrene, α-n-butyl acrylate and methyl methacrylate as monomer, polyoxyethylene octylphenol ether (TX-30) and sodium dodecyl sulfate(SDS) as combine emulsifier, divinyl benzene and ammonium persulfate (APS) as initiator，respectively. The prepared microgel was analyzed by a variety of measurment methods, such as Fourier transform infrared spectroscopy and transmission electron microscopy. The effect of microgel on the rheological properties of adhesives, leveling, mechanical properties and pigment printing performance was studied. The rhelogy and the color fastness of the pigment printing binder of printed fabrics were measured by rheometer and friction color fastness test instruments, respectively. At the same time, the mechanical properties of the adhesive film was measured by strength tester. The results show that the thixotropy, leveling and mechanical properties of adhesive printing binder and pringting quality of coating fabrics were improved when the microgel was added.

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