Quantitative thermal performance evaluation of a cost-effective vapor chamber heat sink containing a metal-etched microwick structure for advanced microprocessor cooling

2005 ◽  
Vol 121 (2) ◽  
pp. 549-556 ◽  
Author(s):  
Jeung Sang Go
2016 ◽  
Vol 25 ◽  
pp. 1182-1190 ◽  
Author(s):  
Jesto Thomas ◽  
P.V.S.S. Srivatsa ◽  
S. Ramesh Krishnan ◽  
Rajesh Baby

2019 ◽  
Vol 149 ◽  
pp. 220-230 ◽  
Author(s):  
S.W. Chang ◽  
K.F. Chiang ◽  
W.L. Cai

Author(s):  
Hung-Yi Li ◽  
Ming-Hung Chiang ◽  
Chih-I Lee ◽  
Wen-Jei Yang

This work experimentally studies the thermal performance of plate-fin vapor chamber heat sinks using infrared thermography. The effects of the fin width, the fin height and the Reynolds number on the thermal performance are considered. The results show that generated heat is transferred more uniformly to the base plate by a vapor chamber heat sink than by a similar aluminum heat sink. Therefore, the maximum temperature is effectively reduced. The overall thermal resistance of the vapor chamber heat sink declines as the Reynolds number increases, but the strength of the effect falls. The effect of the fin dimensions on the thermal performance is stronger at a lower Reynolds number.


2019 ◽  
Vol 50 (8) ◽  
pp. 757-772 ◽  
Author(s):  
Yicang Huang ◽  
Hui Li ◽  
Shengnan Shen ◽  
Yongbo Xue ◽  
Mingliang Xu ◽  
...  

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