Thermal performance enhancement of vapor chamber by coating mini-channel heat sink with porous sintering media

2018 ◽  
Vol 126 ◽  
pp. 116-122 ◽  
Author(s):  
Songkran Wiriyasart ◽  
Paisarn Naphon
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Performance Enhancement ◽  
Vapor Chamber

Thermal Performance Enhancement of Glass Interposer

2015 ◽  
Author(s):  
Sangbeom Cho ◽  
Yogendra K. Joshi
Keyword(s):  
Thermal Conductivity ◽  
Thermal Performance ◽  
Lower Cost ◽  
Performance Enhancement ◽  
Vapor Chamber ◽  
Low Loss ◽  
Packaging Technology ◽  
High Electrical Resistivity ◽  
Fundamental Limitations ◽  
Out Of Plane

As demands on performance for mobile electronics continue to increase, traditional packaging technology is facing its limit in number of input/outputs (I/Os) and thermal challenges. Glass interposers offer many advantages over previous packaging technology for mobile electronics, including ultra-high electrical resistivity, low loss, and lower cost at processed interposer levels. However, it has two fundamental limitations; brittleness and relatively low thermal conductivity (∼1 W/mK), compared to Si (∼150 W/mK). This paper presents a study on thermal performance enhancement of glass interposer based on thermal modeling, and compares it with silicon interposer. The model captures in-plane and out-of-plane thermal performance enhancement with copper structures incorporated in the interposer. To further study the effect of advanced cooling schemes on interposer technology, an integrated vapor chamber design is evaluated through computational modeling.

Performance Enhancement of Air Cooled Heat Sink Used in Inverter Drives of Residential Air Conditioners

2020 ◽  
Vol 28 (01) ◽  
pp. 2050008
Author(s):  
Vignesh Lakshmanan ◽  
Pushpak Doiphode ◽  
Indraneel Samanta
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Heat Sink ◽  
Performance Enhancement ◽  
Air Conditioner ◽  
Electronic Components ◽  
Variable Frequency Drive ◽  
Air Conditioners ◽  
Baseline Case ◽  
Heating Load

Inverter air conditioners are being widely used in the air conditioning sector for energy saving purposes. These air conditioners use an inverter or a variable frequency drive (VFD) to control the compressor operating speed based on cooling or heating load fluctuations. If the heat generated by the electronic components of the VFD is not dissipated properly, it can lead to failure of the VFD. In general, a heat sink is used for dissipating the heat generated by the electronic components of the VFD. The heat sink can be either air cooled or liquid cooled. Using computational fluid dynamics (CFD), this paper deals with optimization of the thermal performance of an air cooled plate-fin heat sink with rectangular fins used in a residential split inverter air conditioner. Commercially available CFD tool has been used for simulations. It has been observed that enhancing fluid flow around the heat sink and improving heat transfer area of the fins significantly improve the thermal performance of the heat sink. By using heat sink with rectangular fins having a stepped profile, it has been possible to improve the heat transfer from the baseline case by 27%. Whereas, by using hollow fins, heat transfer improvement of 20% has been achieved.

Small-Scale Vorticity Induced by a Self-Oscillating Fluttering Reed for Heat Transfer Augmentation in Air Cooled Heat Sinks

2015 ◽  
Author(s):  
Pablo Hidalgo ◽  
Ari Glezer
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Thermal Performance ◽  
Heat Sink ◽  
Performance Enhancement ◽  
Single Channel ◽  
Base Flow ◽  
Fluid Power ◽  
Small Scale

Heat transfer in a high aspect ratio, rectangular mm-scale channel that models a segment of a high-performance, air-cooled heat-sink is enhanced by deliberate formation of unsteady small-scale vortical motions. These small-scale motions are induced by self-fluttering, cantilevered planar thin-film reeds that are placed along the channel’s centerline. Heat transfer is enhanced by significant increases in both the local heat transfer coefficient at the fins surfaces, and in the mixing between the thermal boundary layers and the cooler core flow. The present investigation characterizes the thermal performance enhancement by reed actuation compared to the base flow (in the absence of the reeds) in terms of increased power dissipation over a range of flow rates, along with the associated fluid power. It is shown that because the cooling flow rate that is needed to sustain a given heat flux at a given surface temperature is almost two times higher than in the presence of the reeds, the reeds lead to a four-fold increase in thermal performance (as measured by the ratio of power dissipated to fluid power). The thermal effectiveness of the reeds is tested in a multi-channel heat sink, and it is shown that the improvement in heat transfer coefficient of the base flow is similar to that of the single channel.

Experimental Investigation of Thermal Performance of Vapor Chamber Heat Sinks

2010 ◽  
Author(s):  
Hung-Yi Li ◽  
Ming-Hung Chiang ◽  
Chih-I Lee ◽  
Wen-Jei Yang
Keyword(s):  
Experimental Investigation ◽  
Reynolds Number ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Base Plate ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Vapor Chamber ◽  
Lower Reynolds Number

This work experimentally studies the thermal performance of plate-fin vapor chamber heat sinks using infrared thermography. The effects of the fin width, the fin height and the Reynolds number on the thermal performance are considered. The results show that generated heat is transferred more uniformly to the base plate by a vapor chamber heat sink than by a similar aluminum heat sink. Therefore, the maximum temperature is effectively reduced. The overall thermal resistance of the vapor chamber heat sink declines as the Reynolds number increases, but the strength of the effect falls. The effect of the fin dimensions on the thermal performance is stronger at a lower Reynolds number.

NUMERICAL ANALYSIS OF THE THERMAL PERFORMANCE OF A NOVEL DOUBLE-LAYERED HEAT SINK WITH STAGGERED PIN FINS

2019 ◽  
Vol 50 (8) ◽  
pp. 757-772 ◽  
Author(s):  
Yicang Huang ◽  
Hui Li ◽  
Shengnan Shen ◽  
Yongbo Xue ◽  
Mingliang Xu ◽  
...  
Keyword(s):  
Numerical Analysis ◽  
Thermal Performance ◽  
Heat Sink ◽  
Pin Fins
Sign in / Sign up

Export Citation Format

Share Document