Thermal expansion imaging and finite element simulation of hot lines in high power AlGaN HEMT devices

2004 ◽  
Vol 35 (3-6) ◽  
pp. 477-484 ◽  
Author(s):  
D. Dietzel ◽  
R. Meckenstock ◽  
S. Chotikaprakhan ◽  
J. Bolte ◽  
J. Pelzl ◽  
...  
2007 ◽  
Vol 339 ◽  
pp. 276-280
Author(s):  
Y.T. Yu ◽  
Wei Zheng Yuan ◽  
D.Y. Qiao

Bifurcation of multi-layer microstructures subjected to thermal loading can be harmful for reliability and stability of MEMS structures. In this paper, three imperfections of geometry, coefficient of thermal expansion and thermal loading were introduced to investigate their effects on structural bifurcation by finite element simulation. Results show that bifurcation is strongly influenced by the imperfections. With larger deviation of imperfections, it results in a decreasing temperature to trigger the bifurcation and a gradual beginning of it.


Author(s):  
Hitesh Gowda Bettaswamy Gowda ◽  
Ulrike Wallrabe

In this paper, we present a finite element simulation of an adaptive piezoelectric fluid-membrane lens modeled in COMSOL Multiphysics. The simulation couples the piezoelectric effect with the fluid dynamics to model the interaction between piezoelectric forces and fluid forces. Also, the simulation is extended to model the thermal expansion of the fluid. Finally, we compare the simulation and experimental results of the adaptive lens refractive power at different actuation levels and temperatures.


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