Atomic simulation of the orientation effects on crack tip behavior in titanium single crystal

2020 ◽  
Vol 110 ◽  
pp. 102791
Author(s):  
Le Chang ◽  
Takayuki Kitamura ◽  
Chang-Yu Zhou
Keyword(s):  
Single Crystal ◽  
Crack Tip ◽  
Atomic Simulation ◽  
Orientation Effects

Prediction of the Initial Crack Tip Microstructure in a Single Crystal of CuAlNi

1999 ◽  
Author(s):  
Galyna M. Vasko ◽  
Perry H. Leo ◽  
Thomas W. Shield
Keyword(s):  
Stress Field ◽  
Single Crystal ◽  
Crack Opening ◽  
Crack Tip ◽  
Initial Crack ◽  
Single Edge ◽  
Opening Displacement ◽  
Elastic Crack ◽  
Maximum Work ◽  
Anisotropic Elastic

Abstract The austenite to martensite pseudoelastic transformation induced by the anisotropic elastic crack tip stress field in a single crystal of shape memory alloy is considered. It is proposed that the orientation of the initial austenite-martensite interface that forms can be predicted based on knowledge of the stress field, the crystallography of the transformation and one of two selection criteria. These criteria are based on the work of formation of the martensite in stress field and the crack opening displacement the martensite causes at the crack. Predictions of the criteria are compared to experiments on three single edge notched CuAlNi single crystal specimens. Results indicate that the maximum work criterion accurately predicts the orientation of the austenite-martensite interfaces that initially form near a crack.

Crack tip plasticity in single crystal UO2: Atomistic simulations

2012 ◽  
Vol 430 (1-3) ◽  
pp. 96-105 ◽  
Author(s):  
Yongfeng Zhang ◽  
Xiang-Yang Liu ◽  
Paul C. Millett ◽  
Michael Tonks ◽  
David A. Andersson ◽  
...  
Keyword(s):  
Single Crystal ◽  
Crack Tip ◽  
Atomistic Simulations ◽  
Crack Tip Plasticity

Simulation of near-Crack-Tip Strain Fields on Single-Crystal Silicon Wafer

2012 ◽  
Vol 430-432 ◽  
pp. 404-407
Author(s):  
J.J. Li ◽  
C.W. Zhao ◽  
Y.M. Xing ◽  
Z.Y. Lv ◽  
Y.G. Du
Keyword(s):  
Single Crystal ◽  
Silicon Wafer ◽  
Single Crystal Silicon ◽  
Crack Tip ◽  
Tensile Load ◽  
Crystal Silicon ◽  
Strain Fields ◽  
Single Crystal Silicon Wafer ◽  
Linear Elastic ◽  
Technological Developments

The failure components made of silicon is an important issue in the electronic and nano-technological developments. A study on the near-crack-tip deformation of single-crystal silicon wafer under tensile load was presented. The strain formulas around the crack tip of mode I crack were deduced from linear elastic fracture mechanics. The strain fields around the crack tip were simulated and analyzed in detail.

Atomistic Simulation of Deformation Behavior at a Crack Tip in Magnesium Single Crystal

2011 ◽  
Vol 675-677 ◽  
pp. 949-951
Author(s):  
Li Ming Jiang ◽  
Ya Fang Guo
Keyword(s):  
Molecular Dynamics ◽  
Single Crystal ◽  
Deformation Behavior ◽  
Atomistic Simulation ◽  
Shear Banding ◽  
Crack Tip ◽  
Temperature Deformation ◽  
Dynamics Simulations ◽  
Main Deformation ◽  
Model Crack

The mechanisms of low-temperature deformation around a crack tip in a hexagonally closed-packed (hcp) magnesium single crystal have been studied by molecular dynamics simulations. In our simulation a {1010} < 12 10 > model I (opening model) crack is selected. The results indicate that slip on the basal plane is activated due to the shear stress at the crack tip. Thus shear banding caused by a successive slip of the basal planes is the main deformation way for this type of crack.

Crack Analysis of Unfilled Natural Rubber Using Infrared Microspectroscopy

1997 ◽  
Vol 70 (2) ◽  
pp. 271-282 ◽  
Author(s):  
Lori Neumeister ◽  
J. L. Koenig
Keyword(s):  
Molecular Structure ◽  
Natural Rubber ◽  
Bulk Material ◽  
Crack Tip ◽  
Resistant Material ◽  
Crack Analysis ◽  
Infrared Microspectroscopy ◽  
Orientation Effects ◽  
Transmission And Reflection

Abstract The characterization and analysis of the crack tip region of unfilled natural rubber is crucial in developing a fatigue resistant material. Therefore, the molecular structure and orientation of the material in the crack tip region has been compared to the bulk. Cracks formed by different methods were evaluated using both transmission and reflection techniques of infrared microspectroscopy. The material around the crack tip and crack edges shows much higher absorbances than the bulk material for stressed rubber. This is due to a higher concentration of material and residual orientation effects. For unstressed material the crack tip region exhibits identical characteristics to the bulk material.

Cleavage crack-tip deformation in single-crystal zinc

1989 ◽  
Vol 22 (7) ◽  
pp. 991-993 ◽  
Author(s):  
Fu Ran ◽  
Q Y Long ◽  
T Y Zhang ◽  
C W Lung
Keyword(s):  
Single Crystal ◽  
Crack Tip ◽  
Cleavage Crack
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