Residual stress control of Cu film deposited using a pulsed direct current magnetron sputtering

2018 ◽  
Vol 660 ◽  
pp. 601-605 ◽  
Author(s):  
Tae Hyung Kim ◽  
Soo Jung Lee ◽  
Do Han Kim ◽  
Dong Woo Kim ◽  
Jeong Woon Bae ◽  
...  
2018 ◽  
Vol 662 ◽  
pp. 145-154 ◽  
Author(s):  
Benjamin V.T. Hanby ◽  
Bryan W. Stuart ◽  
Colin Grant ◽  
Jonathan Moffat ◽  
Jonathan Blissett ◽  
...  

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