tin thin films
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2022 ◽  
Vol 123 ◽  
pp. 111936
Author(s):  
M. Novaković ◽  
M. Popović ◽  
P. Noga ◽  
D. Vaňa ◽  
C. Ronning

2021 ◽  
Author(s):  
Taras T. Kovaliuk ◽  
Mykhailo M. Solovan ◽  
Andrii I. Mostovyi ◽  
Ivan G. Оrletskyi

Coatings ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 1418
Author(s):  
Yi-Jun Jen ◽  
Wei-Chieh Ma ◽  
Ting-Yen Lin

TiN thin films were obliquely bideposited with different subdeposit thicknesses. The morphology of the bideposited film was varied from a nano-zigzag array to a vertically grown columnar structure by reducing the subdeposit thickness. The principal index of refraction and extinction coefficient were obtained to explain the measured reflectance and transmittance spectra. The loss of the bideposited thin film decreased as the thickness of the subdeposit decreased. The principal indices for normal incidence were near or under unity, indicating the low reflection by the bideposited thin films. A TiN film with a subdeposit thickness of 3 nm demonstrated an average index of refraction of 0.83 and extinction coefficient of below 0.2 for visible wavelengths. The retrieved principal refractive indexes explained the anisotropic transmission and reflection. For most normal incident cases, the analysis offers the tunable anisotropic property of a TiN nanostructured film for multilayer design in the future.


2021 ◽  
pp. 114547
Author(s):  
Siddharth Gupta ◽  
Ritesh Sachan ◽  
Jagdish Narayan

2021 ◽  
Vol 267 ◽  
pp. 124648
Author(s):  
Susmita Chowdhury ◽  
Rachana Gupta ◽  
Shashi Prakash ◽  
Layanta Behera ◽  
D.M. Phase ◽  
...  
Keyword(s):  

2021 ◽  
pp. 109844
Author(s):  
Zaoli Zhang ◽  
Arsham Ghasemi ◽  
Nikola Koutná ◽  
Zhen Xu ◽  
Thomas Grünstäudl ◽  
...  

2021 ◽  
Vol 291 ◽  
pp. 129554
Author(s):  
Hyunchol Cho ◽  
Ben Nie ◽  
Ajit Dhamdhere ◽  
Yifei Meng ◽  
Monica Neuburger ◽  
...  

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Sachin Yadav ◽  
Vinay Kaushik ◽  
M. P. Saravanan ◽  
R. P. Aloysius ◽  
V. Ganesan ◽  
...  

AbstractDisorder induced phase slip (PS) events appearing in the current voltage characteristics (IVCs) are reported for two-dimensional TiN thin films produced by a robust substrate mediated nitridation technique. Here, high temperature annealing of Ti/Si3N4 based metal/substrate assembly is the key to produce majority phase TiN accompanied by TiSi2 & elemental Si as minority phases. The method itself introduces different level of disorder intrinsically by tuning the amount of the non-superconducting minority phases that are controlled by annealing temperature (Ta) and the film thickness. The superconducting critical temperature (Tc) strongly depends on Ta and the maximum Tc obtained from the demonstrated technique is about 4.8 K for the thickness range ~ 12 nm and above. Besides, the dynamics of IVCs get modulated by the appearance of intermediated resistive steps for decreased Ta and the steps get more prominent for reduced thickness. Further, the deviation in the temperature dependent critical current (Ic) from the Ginzburg–Landau theoretical limit varies strongly with the thickness. Finally, the Tc, intermediate resistive steps in the IVCs and the depairing current are observed to alter in a similar fashion with Ta and the thickness indicating the robustness of the synthesis process to fabricate disordered nitride-based superconductor.


AIP Advances ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 045204
Author(s):  
Manosi Roy ◽  
Nikhil Reddy Mucha ◽  
Svitlana Fialkova ◽  
Dhananjay Kumar
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