scholarly journals TiN diffusion barrier for stable W/SiC(0001) interfaces in inert ambient at high temperature

2019 ◽  
Vol 670 ◽  
pp. 54-59 ◽  
Author(s):  
Steven DelaCruz ◽  
Zhongtao Wang ◽  
Ping Cheng ◽  
Carlo Carraro ◽  
Roya Maboudian
Keyword(s):  
High Temperature ◽  
Diffusion Barrier ◽  
Tin Diffusion Barrier

Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier

2009 ◽  
Vol 38 (12) ◽  
pp. 2668-2675 ◽  
Author(s):  
Seongjun Kim ◽  
Keun-Soo Kim ◽  
Sun-Sik Kim ◽  
Katsuaki Suganuma ◽  
Goro Izuta
Keyword(s):  
High Temperature ◽  
Diffusion Barrier ◽  
Die Attachment ◽  
Free Solder ◽  
Tin Diffusion Barrier

scholarly journals Diffusion Barrier Layer For High-temperature Protective Coatings

2016 ◽  
Vol 2016 (4) ◽  
pp. 36-44 ◽  
Author(s):  
K.Yu. Yakovchuk ◽  
◽  
A.V. Mikitchik ◽  
Yu.E. Rudoy ◽  
A.O. Akhtyrsky ◽  
...  
Keyword(s):  
High Temperature ◽  
Barrier Layer ◽  
Diffusion Barrier ◽  
Protective Coatings ◽  
Diffusion Barrier Layer

Preferentially oriented and amorphous Ti, TiN and Ti/TiN diffusion barrier for Cu prepared by ion beam assisted deposition (IBAD)

2002 ◽  
Vol 151-152 ◽  
pp. 434-439 ◽  
Author(s):  
Kewei Chen ◽  
Yuhui Yu ◽  
Haichuan Mu ◽  
E.Z. Luo ◽  
B. Sundaravel ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Ion Beam ◽  
Ion Beam Assisted Deposition ◽  
Tin Diffusion Barrier

scholarly journals Influence of Ni Catalyst Layer and TiN Diffusion Barrier on Carbon Nanotube Growth Rate

2010 ◽  
Vol 5 (3) ◽  
pp. 539-544 ◽  
Author(s):  
Jean-Baptiste A. Kpetsu ◽  
Pawel Jedrzejowski ◽  
Claude Côté ◽  
Andranik Sarkissian ◽  
Philippe Mérel ◽  
...  
Keyword(s):  
Growth Rate ◽  
Carbon Nanotube ◽  
Diffusion Barrier ◽  
Catalyst Layer ◽  
Ni Catalyst ◽  
Carbon Nanotube Growth ◽  
Nanotube Growth ◽  
Tin Diffusion Barrier

Structure and Oxidation Behavior of Gradient Zr/ZrN/Zr Diffusion Barrier on the Ni-Based Superalloy by Arc Ion Plating

2010 ◽  
Vol 97-101 ◽  
pp. 1479-1483
Author(s):  
Yan Cai ◽  
Chun Hu Tao ◽  
Feng Lu ◽  
Jian Ping Li
Keyword(s):  
High Temperature ◽  
Diffusion Barrier ◽  
High Temperature Oxidation ◽  
Oxidation Behavior ◽  
Middle Layer ◽  
Temperature Oxidation ◽  
Arc Ion Plating ◽  
Ion Plating ◽  
Gradient Diffusion ◽  
High Temperature Oxidation Behavior

Gradient Zr/ZrN/Zr layer was deposited as a diffusion barrier between the NiCrAlYSi The overlay coating and Ni-base superalloy DZ125 by arc ion plating(AIP). The microstructure and high-temperature oxidation behavior of the diffusion barrier were studied. The results show that the gradient diffusion barrier is homogeneous and compact, and has strong bond strength with the substrate. The diffusion barrier is composed of three layers, among which the inner and outer layers are rich in Zr, and the middle layer is rich in ZrN. The main phase structure of the diffusion barrier is ZrN(200). During high temperature oxidation at 1100°C, the Zr/ZrN/Zr/HY3 compound coating system presents excellent oxidation resistance.

The Investigation of the Interdiffusion Barrier in TiAl/MCrAlY System

2010 ◽  
Vol 654-656 ◽  
pp. 1920-1923 ◽  
Author(s):  
Wen Wang ◽  
Yu Xian Cheng ◽  
Sheng Long Zhu ◽  
Fu Hui Wang ◽  
Li Xin
Keyword(s):  
High Temperature ◽  
Oxidation Resistance ◽  
Diffusion Barrier ◽  
High Temperature Oxidation ◽  
Temperature Oxidation ◽  
The Poor ◽  
Structural Applications ◽  
Nicraly Coating ◽  
Overlay Coatings ◽  
Poor Oxidation Resistance

TiAl based alloys are promising candidates for structural applications at high temperature. However, the poor oxidation resistance above 800oC obviously restrains their applications. Although NiCrAlY overlay coatings can remarkably improve the high temperature oxidation resistance of TiAl, serious inward diffusion of Ni from the coating to the substrate occurs which could reduce the lifetime of the coating/substrate system. Apparently, the development of interdiffusion barrier could overcome the disadvantage of the NiCrAlY/TiAl system. In this work, Ta, TiN and Cr2O3 interlayers were deposited between NiCrAlY coating and γ-TiAl substrate as diffusion barrier (DB). The interdiffusion behavior of the TiAl/DB/NiCrAlY system was investigated at 1000°C. The results showed that the metallic and nitride interlayers cannot retard the interdiffusion of Ni effectively. As an active diffusion barrier, the oxide interlayer obviously suppressed the inward diffusion of Ni from the coating to the substrate by the formation of alumina-rich layers at both the TiAl/DB and DB/NiCrAlY interfaces.

OMCVD TiN diffusion barrier for copper contact and via/interconnects structures

1998 ◽  
Author(s):  
C. Marcadal ◽  
E. Richard ◽  
J. Torres ◽  
J. Palleau ◽  
L. Ulmer ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Tin Diffusion Barrier
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