Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment

2015 ◽  
Vol 41 ◽  
pp. 134-141 ◽  
Author(s):  
Fu-Rong Xiu ◽  
Yingying Qi ◽  
Fu-Shen Zhang
2014 ◽  
Vol 13 (10) ◽  
pp. 2601-2607 ◽  
Author(s):  
Jae-chun Lee ◽  
Manoj Kumar ◽  
Min-Seuk Kim ◽  
Jinki Jeong ◽  
Kyoungkeun Yoo

Micromachines ◽  
2021 ◽  
Vol 12 (7) ◽  
pp. 793
Author(s):  
Uroš Zupančič ◽  
Joshua Rainbow ◽  
Pedro Estrela ◽  
Despina Moschou

Printed circuit boards (PCBs) offer a promising platform for the development of electronics-assisted biomedical diagnostic sensors and microsystems. The long-standing industrial basis offers distinctive advantages for cost-effective, reproducible, and easily integrated sample-in-answer-out diagnostic microsystems. Nonetheless, the commercial techniques used in the fabrication of PCBs produce various contaminants potentially degrading severely their stability and repeatability in electrochemical sensing applications. Herein, we analyse for the first time such critical technological considerations, allowing the exploitation of commercial PCB platforms as reliable electrochemical sensing platforms. The presented electrochemical and physical characterisation data reveal clear evidence of both organic and inorganic sensing electrode surface contaminants, which can be removed using various pre-cleaning techniques. We demonstrate that, following such pre-treatment rules, PCB-based electrodes can be reliably fabricated for sensitive electrochemical biosensors. Herein, we demonstrate the applicability of the methodology both for labelled protein (procalcitonin) and label-free nucleic acid (E. coli-specific DNA) biomarker quantification, with observed limits of detection (LoD) of 2 pM and 110 pM, respectively. The proposed optimisation of surface pre-treatment is critical in the development of robust and sensitive PCB-based electrochemical sensors for both clinical and environmental diagnostics and monitoring applications.


JOM ◽  
2020 ◽  
Author(s):  
Joona Rajahalme ◽  
Siiri Perämäki ◽  
Roshan Budhathoki ◽  
Ari Väisänen

AbstractThis study presents an optimized leaching and electrowinning process for the recovery of copper from waste printed circuit boards including studies of chemical consumption and recirculation of leachate. Optimization of leaching was performed using response surface methodology in diluted sulfuric acid and hydrogen peroxide media. Optimum leaching conditions for copper were found by using 3.6 mol L−1 sulfuric acid, 6 vol.% hydrogen peroxide, pulp density of 75 g L−1 with 186 min leaching time at 20°C resulting in complete leaching of copper followed by over 92% recovery and purity of 99.9% in the electrowinning. Study of chemical consumption showed total decomposition of hydrogen peroxide during leaching, while changes in sulfuric acid concentration were minor. During recirculation of the leachate with up to 5 cycles, copper recovery and product purity remained at high levels while acid consumption was reduced by 60%.


Sign in / Sign up

Export Citation Format

Share Document