Time-dependent dielectric wearout technique with temperature effect for reliability test of ultrathin (<2.0 nm) single layer and dual layer gate oxides

2000 ◽  
Vol 40 (12) ◽  
pp. 1987-1995
Author(s):  
Yider Wu ◽  
Qi Xiang ◽  
Jean Y.M. Yang ◽  
Gerald Lucovsky ◽  
Ming-Ren Lin
1999 ◽  
Vol 20 (6) ◽  
pp. 262-264 ◽  
Author(s):  
Yider Wu ◽  
Qi Xiang ◽  
D. Bang ◽  
G. Lucovsky ◽  
Ming-Ren Lin
Keyword(s):  

2002 ◽  
Vol 41 (Part 1, No. 4B) ◽  
pp. 2426-2430 ◽  
Author(s):  
Wataru Mizubayashi ◽  
Yuichi Yoshida ◽  
Seiichi Miyazaki ◽  
Masataka Hirose

1990 ◽  
Vol 112 (2) ◽  
pp. 245-256 ◽  
Author(s):  
P. M. Pinsky ◽  
N. N. Abboud

Considerable progress has been made in the development of numerical methods for the time-harmonic exterior structural acoustics problem involving solution of the coupled Helmholtz equation. In contrast, numerical solution procedures for the transient case have not been studied so extensively. In this paper a finite element formulation is proposed for solution of the time-dependent coupled wave equation over an infinite fluid domain. The formulation is based on a finite computational fluid domain surrounding the structure and incorporates a sequence of boundary operators on the fluid truncation boundary. These operators are designed to minimize reflection of outgoing waves and are based on an asymptotic expansion of the exact solution for the time-dependent problem. In the fluid domain, a mixed two-field finite element approximation, based on a specialization of the Hu-Washizu principle for elasticity, is proposed and employs pressure and displacement potential as independent fields. Since radiation dissipation renders the coupled system nonconservative, a variational formalism based on the Morse and Feshbach concept of a “mirror-image” adjoint system is used. The variational formalism also accommodates viscoelastic dissipation in the structure (or its coatings) and this is considered in the paper. Very accurate results for model problems involving a single layer of fluid elements have been obtained and are discussed in detail.


2014 ◽  
Vol 39 (20) ◽  
pp. 10718-10723 ◽  
Author(s):  
Huiqing Hu ◽  
Qizhao Lin ◽  
Zhigang Zhu ◽  
Xiangrong Liu ◽  
Bin Zhu

2021 ◽  
Author(s):  
Dila Türkmen ◽  
Merve Acer Kalafat

In this paper we present the lamination curing as a stand-alone method to activate the silver nanoparticle (Ag NP) inkjet printed angle sensors on a 0.14 mm PET substrate, with a desktop printer. (With the term “lamination curing”, we refer passing the printed sample through a lamination machine, without any actual laminating purpose, only for curing.) We compared the method with the oven curing, which is the widest used method for the intended sensors, and found that lamination cured sensors give lower sheet resistance, lower fabrication uncertainty and more consistent angle sensing behaviors with higher sensing performance. Different curing parameters are inspected and a process under 3 minutes is achieved giving a 0.06 Ohm/square sheet resistance. For such a low sheet resistance, presented method has the lowest thermal curing time among all single layer Ag NP printing studies in the literature. An experimental model is presented for the sheet resistance - aspect ratio relation for both methods. Time dependent resistance shifts of the lamination cured sensors are also inspected and proved to be insignificant. We state lamination curing as an advantageous and reliable alternative to oven curing and other fast curing methods both for sensor and circuitry printing implementations.


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