Anisotropic dielectric response and surface aging of mercuric iodide crystal studied by variable angle spectroscopic ellipsometry

1998 ◽  
Vol 313-314 ◽  
pp. 351-355 ◽  
Author(s):  
H. Yao ◽  
Jay C. Erickson ◽  
L.A. Lim ◽  
Ralph B. James
1993 ◽  
Vol 302 ◽  
Author(s):  
Huade Yao ◽  
Blaine Johs

ABSTRACTVariable angle spectroscopic ellipsometry (VASE) measurements were employed to study the optical properties of HgI2. The bulk crystal HgI2 surface was subjected to a 10% KI etching prior to the VASE measurements. SE measurements were performed at room temperature, in air with several different angles of incidence. The uniaxial anisotropic nature of the HgI2 crystal was treated in the VASE analysis. Anisotropic dielectric functions of single crystal HgI2, ε||(wo) and ε⊥(ω), for optical electric field vector oriented parallel and perpendicular to the c axis, respectively, were obtained in the range of ∼2.0 - 5.0 eV. Surface aging effects of the HgI2 crystal, after the 10% KI etching, were characterized by VASE.


1996 ◽  
Vol 449 ◽  
Author(s):  
H. Yao ◽  
C. H. Yan ◽  
H. A. Jenkinson ◽  
J. M. Zavada ◽  
J. S. Speck ◽  
...  

ABSTRACTVariable angle spectroscopic ellipsometry (VASE) and transmission measurements have been employed to study the dielectric response of gallium nitride (GaN) thin films — an important material for light emitting diodes (LEDs) and laser diodes applications. The GaN films were grown by atomsphere pressure metal organic chemical vapor deposition (MOCVD) on c-plane sapphire substrates (α-AI2O3). Room temperature VASE measurements were made, in the range of 0.75 to 5.5eV, at the angle of incidence of 73, 75, and 77 degree, respectively. Evidence of anisotropy is observed especially in the spectral range under the band gap (∼3.4 eV), reflecting the nature of wurtzite crystal structure of GaN. The ordinary dielectric function ε⊥(ω) of GaN were obtained through the analysis of transmission and VASE data in the range below and above the band gap. The thickness of these GaN films is also determined via the analysis.


1988 ◽  
Vol 64 (8) ◽  
pp. 4175-4180 ◽  
Author(s):  
S. Orzeszko ◽  
Bhola N. De ◽  
John A. Woollam ◽  
John J. Pouch ◽  
Samuel A. Alterovitz ◽  
...  

2000 ◽  
Vol 609 ◽  
Author(s):  
S. Paprotta ◽  
K. S. Röver ◽  
R. Ferretti ◽  
U. Höhne ◽  
J. D. Kähler ◽  
...  

ABSTRACTUp to now an in-line method for parameter determination of deposited thin polysilicon films is not available. In this paper a method for monitoring the polysilicon deposition process in device manufacturing by variable angle spectroscopic ellipsometry (VASE) is demonstrated. Therefore several polysilicon films are deposited on thermally oxidized [100] silicon wafers. These samples are characterized by VASE in the optical range of 450 - 850 nm. Parameters are determined by simulation using a multilayer model consisting of air, interface layer (surface roughness), polysilicon, SiO2 and silicon substrate. Different optical models representing the properties of polysilicon are tested. The free parameters are the oxide thickness, the composition and the thickness of the interface layer (air, polysilicon) as well as the thickness and the complex refractive index of the polysilicon layer. Results of the spectroscopic analysis are verified by AFM and SEM measurements. It can be shown that parameters of the deposited polysilicon films, which often could only be determined by complex and destructive off-line analysis methods are also accessible by non-destructive in-line VASE measurements.


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