Effect of Rare Earth Pr on Creep Behavior of Sn-0.3Ag-0.7Cu-0.5Ga Low-Ag Solder Alloys

2018 ◽  
Vol 47 (9) ◽  
pp. 2657-2662 ◽  
Author(s):  
Wang Bo ◽  
Xue Songbai ◽  
Wang Jianxin ◽  
Long Weimin ◽  
Zhang Qingke
Keyword(s):  
Rare Earth ◽  
Creep Behavior ◽  
Solder Alloys

Compressive creep behavior of hot-pressed Si3N4 ceramics using alumina and a rare earth solid solution as additives

2005 ◽  
Vol 23 (3) ◽  
pp. 183-192 ◽  
Author(s):  
C. Santos ◽  
K. Strecker ◽  
M.J.R. Barboza ◽  
F. Piorino Neto ◽  
O.M.M. Silva ◽  
...  
Keyword(s):  
Solid Solution ◽  
Rare Earth ◽  
Creep Behavior ◽  
Compressive Creep ◽  
Si3n4 Ceramics

Creep Behavior of Multi-Cation α-SiAlON Partially Stabilized Produced with an Yttrium-Rare Earth Oxide Mixture(CRE2O3)

2005 ◽  
Vol 498-499 ◽  
pp. 575-580
Author(s):  
Claudinei dos Santos ◽  
Kurt Strecker ◽  
M.J.R. Barboza ◽  
Sandro Aparecido Baldacim ◽  
Francisco Piorino Neto ◽  
...  
Keyword(s):  
Solid Solution ◽  
Rare Earth ◽  
High Temperature ◽  
Liquid Phase ◽  
Creep Behavior ◽  
Rare Earth Oxide ◽  
Si3n4 Ceramic ◽  
Creep Tests ◽  
Oxide Mixture ◽  
Metallic Cations

a−SiAlON (a’) is a solid solution of a−Si3N4, where Si and N are substituted by Al and O, respectively. The principal stabilizers of the a’-phase are Mg, Ca, Y and rare earth cations. In this way, the possible use of the yttrium-rare earth oxide mixture, CRE2O3, produced at FAENQUIL, in obtaining these SiAlONs was investigated. Samples were sintered by hotpressing at 17500C, for 30 minutes, using a sintering pressure of 20 MPa. Creep behavior of the hot-pressed CRE-a-SiAlON/b-Si3N4 ceramic was investigated, using compressive creep tests, in air, at 1280 to 1340 0C, under stresses of 200 to 350 MPa, for 70 hours. This type of ceramic exhibited high creep and oxidation resistance. Its improved high-temperature properties are mainly due to the absence or reduced amount of intergranular phases, because of the incorporation of the metallic cations from the liquid phase formed during sintering into the Si3N4 structure, forming a a’/b composite.

Creep Behavior of Multi-Cation α-SiAlON Partially Stabilized Produced with an Yttrium-Rare Earth Oxide Mixture(CRE2O3)

2005 ◽  
pp. 575-580
Author(s):  
Claudinei dos Santos ◽  
Kurt Strecker ◽  
M.J.R. Barboza ◽  
Sandro Aparecido Baldacim ◽  
F. Piorino Neto ◽  
...  
Keyword(s):  
Rare Earth ◽  
Creep Behavior ◽  
Rare Earth Oxide ◽  
Oxide Mixture

Creep of Si3N4 Based Ceramics for Thermo-Mechanical Applications

2008 ◽  
Vol 591-593 ◽  
pp. 667-672
Author(s):  
Claudinei dos Santos ◽  
Kurt Strecker ◽  
M.J.R. Barboza ◽  
Francisco Piorino Neto ◽  
Olivério Moreira Macedo Silva ◽  
...  
Keyword(s):  
Activation Energy ◽  
Rare Earth ◽  
Creep Behavior ◽  
Creep Deformation ◽  
Phase Content ◽  
Creep Tests ◽  
Intergranular Phase ◽  
Aspect Ratios ◽  
Compressive Stresses ◽  
N2 Atmosphere

Commercial α−Si3N4, Al2O3 and a mixed yttrium and rare earth oxides, RE2O3, were used as starting-powders. Powder batches were milled using different Al2O3/RE2O3 contents, as additive. Hot-pressing was done at 1750oC-30 min-20MPa in N2 atmosphere. Specimens neat to 6x3x3mm3 were polished and characterized by XRD and SEM. Specimens were submitted to creep tests, under compressive stresses between 100 and 350 MPa at temperatures ranging from 1250 to 1300oC in air. Higher additive amounts resulted in larger grains of higher aspect ratios and in a decreased anisotropy in the hot-pressed ceramics. The compressive creep behavior depends on the intergranular phase content. While higher amounts of additives resulted in higher creep rates, • ε , and higher stress exponents, n, the activation energy Qss, has been inferior for samples with lower additive contents. Grain sliding has been identified to be the predominant mechanism responsible for creep deformation of these ceramics.

Strength and Creep Behavior of Rare-Earth Disilicate-Silicon Nitride Ceramics

1992 ◽  
Vol 75 (8) ◽  
pp. 2050-2055 ◽  
Author(s):  
Michael K. Cinibulk ◽  
Gareth Thomas ◽  
Sylvia M. Johnson
Keyword(s):  
Rare Earth ◽  
Silicon Nitride ◽  
Creep Behavior ◽  
Nitride Ceramics

scholarly journals Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free Solders

2018 ◽  
Vol 14 (3) ◽  
pp. 5835-5850
Author(s):  
Amal Mohamed Yassin ◽  
Reda Ismail Afify ◽  
Berlent Khalifa
Keyword(s):  
Creep Behavior ◽  
Axial Ratio ◽  
Lead Free ◽  
Solder Alloys ◽  
Creep Tests ◽  
Scanning Calorimetry ◽  
Thermal Tests ◽  
X Ray ◽  
Morphological Studies ◽  
Residual Strains

Sn-3.5wt.%Ag-0.5wt.%Cu is one of the alloys considered for replacing SnPb solder alloys in electronic ambiance. In the present study, the effect of minor additions of Ti (0.25, 0.5, 1.0 wt.%) on the microstructure, creep and thermal properties of Sn-3.5wt.%Ag-0.5wt.%Cu lead free solder alloy are investigated by means of scanning electron microscopy (SEM), x-ray diffraction (XRD), creep tests and differential scanning calorimetry (DSC) thermal tests. Results showed that the addition of different wt.% of Ti refined the grain size of the solder alloys. The microstructure parameters obtained from x-ray analysis represented by lattice parameters (a,c), axial ratio (c/a), residual strains (?a/a? & ?c/c?), peak height intensities and crystallite size of some crystallographic planes were found to be sensitive to Ti - additions, applied stresses and working temperatures. The morphological studies using SEM showed refinements of Ag3Sn, Cu6Sn5 and Ti2Sn3 (IMCs) in ?-Sn matrix. Thermal analysis showed that Ti - additions slightly affect melting temperature and pastry range. In terms of creep behavior the addition of 1wt.%Ti gave the highest creep resistance with respect to the others, due to fine dispersion of IMCs. The stress exponents (n) and the activation energies (Q) indicated that the dominant creep mechanism is dislocation climb over all temperature ranges

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