COMPARISON OF THERMAL DECOMPOSITION AND SEQUENTIAL DISSOLUTION—TWO SAMPLE PREPARATION METHODS FOR RADIOCARBON DATING OF LIME MORTARS

Radiocarbon ◽  
2021 ◽  
pp. 1-23
Author(s):  
Thomas Schrøder Daugbjerg ◽  
Alf Lindroos ◽  
Irka Hajdas ◽  
Åsa Ringbom ◽  
Jesper Olsen

ABSTRACT Dating lime mortar samples using the radiocarbon (14C) method can be difficult. This is because the contamination is similar to the primary dating material (CaCO3) and consequently difficult to remove. Mortar can also have late-in-formation pyrogenic carbonate from interactions with the environment after the initial hardening phase, such as recrystallization, fire damage or delayed hardening. When 14C dating a system of primary dating material, contamination and late-in-formation pyrogenic carbonate, one approach is multi-fraction dating with conclusiveness criteria. If a sample has sufficient contamination or late-in-formation pyrogenic carbonate, the criteria evaluate the result inconclusive. To improve inconclusive results from such samples, this study investigates sample preparation by thermal decomposition. Here samples that were inconclusively dated by the authors’ traditional method, sequential dissolution with 85% phosphoric acid, are investigated further. This study finds that CO2 thermally decomposed at low temperatures contains some late-in-formation pyrogenic carbonate. By rejecting CO2 decomposed at low temperatures, Kastelholm castle and Kimito church in Finland are conclusively and accurately dated. Furthermore, a preheating method removes some late-in-formation carbonate, but not enough for a conclusive result. Finally, thermal decomposition finds difficulty in discerning binder carbonate from limestone and marble contamination.

Planta Medica ◽  
2016 ◽  
Vol 82 (05) ◽  
Author(s):  
M Wilcox ◽  
M Jacyno ◽  
J Marcu ◽  
J Neal-Kababick

Author(s):  
Andrew J. Komrowski ◽  
N. S. Somcio ◽  
Daniel J. D. Sullivan ◽  
Charles R. Silvis ◽  
Luis Curiel ◽  
...  

Abstract The use of flip chip technology inside component packaging, so called flip chip in package (FCIP), is an increasingly common package type in the semiconductor industry because of high pin-counts, performance and reliability. Sample preparation methods and flows which enable physical failure analysis (PFA) of FCIP are thus in demand to characterize defects in die with these package types. As interconnect metallization schemes become more dense and complex, access to the backside silicon of a functional device also becomes important for fault isolation test purposes. To address these requirements, a detailed PFA flow is described which chronicles the sample preparation methods necessary to isolate a physical defect in the die of an organic-substrate FCIP.


2021 ◽  
Vol 20 ◽  
pp. 100079
Author(s):  
Maxwell C. McCabe ◽  
Lauren R. Schmitt ◽  
Ryan C. Hill ◽  
Monika Dzieciatkowska ◽  
Mark Maslanka ◽  
...  

2011 ◽  
Vol 26 (9) ◽  
pp. 1849 ◽  
Author(s):  
J. S. F. Pereira ◽  
C. L. Knorr ◽  
L. S. F. Pereira ◽  
D. P. Moraes ◽  
J. N. G. Paniz ◽  
...  

2011 ◽  
Vol 401 (1) ◽  
pp. 373-380 ◽  
Author(s):  
Orsolya Egressy-Molnár ◽  
Andrea Vass ◽  
Anikó Németh ◽  
Juan F. García-Reyes ◽  
Mihály Dernovics

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