A Simple Low-Vacuum Environmental Cell

2003 ◽  
Vol 9 (1) ◽  
pp. 18-28 ◽  
Author(s):  
Matthew H. Ervin

The environmental cell device discussed in this paper provides a modest low-vacuum scanning electron microscopy (SEM) capability to a standard SEM without requiring additional pumping. This environmental cell confines a volume of low vacuum in contact with the sample surface using a container that has an aperture for admitting the primary electron beam. The aperture is large enough to permit a limited field of view of the sample, and small enough to limit the outflow of gas into the SEM chamber to that which can be accommodated by the standard SEM pumping system. This environmental cell also functions as a gaseous detector device.

Author(s):  
David Joy ◽  
James Pawley

The scanning electron microscope (SEM) builds up an image by sampling contiguous sub-volumes near the surface of the specimen. A fine electron beam selectively excites each sub-volume and then the intensity of some resulting signal is measured. The spatial resolution of images made using such a process is limited by at least three factors. Two of these determine the size of the interaction volume: the size of the electron probe and the extent to which detectable signal is excited from locations remote from the beam impact point. A third limitation emerges from the fact that the probing beam is composed of a finite number of discrete particles and therefore that the accuracy with which any detectable signal can be measured is limited by Poisson statistics applied to this number (or to the number of events actually detected if this is smaller).


2018 ◽  
Author(s):  
Lo Chea Wee ◽  
Tan Sze Yee ◽  
Gan Sue Yin ◽  
Goh Cin Sheng

Abstract Advanced package technology often includes multi-chips in one package to accommodate the technology demand on size & functionality. Die tilting leads to poor device performance for all kinds of multi-chip packages such as chip by chip (CbC), chip on chip (CoC), and the package with both CbC and CoC. Traditional die tilting measured by optical microscopy and scanning electron microscopy has capability issue due to wave or electron beam blocking at area of interest by electronic components nearby. In this paper, the feasibility of using profilemeter to investigate die tilting in single and multi-chips is demonstrated. Our results validate that the profilemeter is the most profound metrology for die tilting analysis especially on multi-chip packages, and can achieve an accuracy of <2μm comparable to SEM.


1999 ◽  
Vol 5 (S2) ◽  
pp. 896-897
Author(s):  
C.B. Vartuli ◽  
F.A. Stevie ◽  
J.B. Bindell ◽  
T.L. Shofner ◽  
B.M. Purcell

Scanning Electron Microscopy/Energy Dispersive Spectroscopy (SEM/EDS) has become less useful for semiconductor samples as feature dimensions decrease. It has become increasingly difficult to get sufficient signal from small features because of the large interaction volume of the primary beam. As the interaction volume is dependent on the accelerating energy of the primary electron beam, decreasing the accelerating voltage will decrease the interaction volume. This increases the percentage of signal from the feature of interest, but also lowers the number of peaks available for interpretation, reducing the sensitivity of the analysis. Several elements commonly used in the fabrication of semiconductors have overlapping peaks at lower energies, and the ability to distinguish between them is lost at low accelerating energies. It is possible to modify samples using Focused Ion Beam (FIB) to improve EDS resolution without decreasing the accelerating voltage.The samples were prepared in an FIE 800 FIB and imaged in an Hitachi S-4700 SEM.


1997 ◽  
Vol 3 (S2) ◽  
pp. 1193-1194
Author(s):  
Brendan J. Griffin

Most scanning electron microscopy is performed at low magnification; applications utilising the large depth of field nature of the SEM image rather than the high resolution aspect. Some environmental SEMs have a particular limitation in that the field of view is restricted by a pressure limiting aperture (PLA) at the beam entry point of the specimen chamber. With the original ElectroScan design, the E-3 model ESEM utilised a 500 urn aperture which gave a very limited field of view (∼550um diameter at a 10mm working distance [WD]). An increase of aperture size to ∼lmm provided an improved but still unsatisfactory field of view. The simplest option to increase the field of view in an ESEM was noted to be a movement of the pressure and field, limiting aperture back towards the scan coils1. This approach increased the field of view to ∼2mm, at a 10mm WD. A commercial low magnification device extended this concept and indicated the attainment of conventional fields of view.


1999 ◽  
Vol 5 (S2) ◽  
pp. 402-403
Author(s):  
Scott Brabec ◽  
Bill Schindeldecker ◽  
Ken Brennen ◽  
Sue Okerstrom ◽  
Ky Pham

The efficiency of implantable electrodes for cardiac pacing depends on the ratio of the conductive surface area to the geometric area of the interface with excitable tissue. New models of heart pacers require reduction of post-pulse polarization, i.e. the potential left on the electrode / tissue interface after a pacemaker pulse. Increasing the conductive surface area is an effective method to this end. Microscopy provides an important tool in elucidating the role of surface structure in electrode performance.Three different surface textures were characterized on a 90% platinum(Pt)/10% iridium (Ir) polished electrode substrate of roughly 5 mm2 geometric surface area. These consisted of the polished substrate itself, a thin film of textured platinum in the 1-3 micron size range, and a sub-micron platinum black coating. Sample surface effects were characterized via scanning electron microscopy (SEM), in-vitro electrical impedance spectrum analysis, and polarization after-potential measurements.


1998 ◽  
Vol 4 (S2) ◽  
pp. 182-183
Author(s):  
John F. Mansfield ◽  
Brett L. Pennington

The environmental scanning electron microscope (Environmental SEM) has proved to be a powerful tool in both materials science and the life sciences. Full characterization of materials in the environmental SEM often requires chemical analysis by X-ray energy dispersive spectroscopy (XEDS). However, the spatial resolution of the XEDS signal can be severely degraded by the gaseous environment in the sample chamber. At an operating pressure of 5Torr a significant fraction of the primary electron beam is scattered after it passes through the final pressure limiting aperture and before it strikes the sample. Bolon and Griffin have both published data that illustrates this effect very well. Bolon revealed that 45% of the primary electron beam was scattered by more than 25 μm in an Environmental SEM operating at an accelerating voltage of 30kV, with a water vapor pressure of 3Torr and a working distance of 15mm.


2011 ◽  
Vol 690 ◽  
pp. 153-156
Author(s):  
Uwe Reisgen ◽  
Simon Olschok ◽  
Alexander Backhaus

This paper gives an account of research which has been carried out on electron-beam brazed specimens made of high-Niobium γ-titanium aluminides. The microstructure in the brazing area of two different brazes (TiCuNi and Ni 102) is explained and analysed via scanning electron microscopy and energy dispersive X-ray spectroscopy.


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