scholarly journals Droplet Control Based on Pinning and Substrate Wettability

Langmuir ◽  
2021 ◽  
Author(s):  
Panagiotis E. Theodorakis ◽  
Alidad Amirfazli ◽  
Bin Hu ◽  
Zhizhao Che
Keyword(s):  
Science ◽  
2005 ◽  
Vol 309 (5736) ◽  
pp. 887-888 ◽  
Author(s):  
M. Joanicot

2012 ◽  
Vol 195 ◽  
pp. 195-197 ◽  
Author(s):  
Ying Hsueh Chang Chien ◽  
Matt Yeh ◽  
Scott Ku ◽  
C.M. Yang ◽  
C.C. Chen ◽  
...  

In semiconductor device manufacturing, single wafer processors are widely used in not only BEOL process but also in FEOL process for 2X devices to improve the cleaning efficiency and get the higher productivity. Because the scaled down devices require the minimum substrate loss in the cleaning steps, the physical force by a dual fluid spray is still the main position to improve the cleaning efficiency at the moment comparing with chemical effects as the dissolution of contaminants and/or the lift off of particles. Sato, et al., reported that the relationship between particle removal and droplet characteristics linked to the droplet energy densityEdas following equation [. The kinetic energyEkof droplet is calculated from droplet diameterdand velocityv, as shown in Equation 1.


2012 ◽  
Vol 2 (1) ◽  
Author(s):  
Alex Grounds ◽  
Richard Still ◽  
Kei Takashina
Keyword(s):  

Micromachines ◽  
2021 ◽  
Vol 12 (3) ◽  
pp. 340
Author(s):  
Lu Tian ◽  
Zi Ye ◽  
Lin Gui

This study presents a dielectrophoresis-based liquid metal (LM) droplet control microfluidic device. Six square liquid metal electrodes are fabricated beneath an LM droplet manipulation pool. By applying different voltages on the different electrodes, a non-uniform electric field is formed around the LM droplet, and charges are induced on the surface of the droplet accordingly, so that the droplet could be driven inside the electric field. With a voltage of ±1000 V applied on the electrodes, the LM droplets are driven with a velocity of 0.5 mm/s for the 2.0 mm diameter ones and 1.0 mm/s for the 1.0 mm diameter ones. The whole chip is made of PDMS, and microchannels are fabricated by laser ablation. In this device, the electrodes are not in direct contact with the working droplets; a thin PDMS film stays between the electrodes and the driven droplets, preventing Joule heat or bubble formation during the experiments. To enhance the flexibility of the chip design, a gallium-based alloy with melting point of 10.6 °C is used as electrode material in this device. This dielectrophoresis (DEP) device was able to successfully drive liquid metal droplets and is expected to be a flexible approach for liquid metal droplet control.


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