Electric Field-Driven Liquid Metal Droplet Generation and Direction Manipulation

A gallium-based liquid metal got high attention recently, due to the excellent material properties that are useful in various research areas. We report here on electric field-induced liquid metal droplet generation and falling direction manipulation. The well-analyzed electro-hydrodynamic method is a selectable way to control the liquid metal, as the liquid metal is conductive. The electric field-induced liquid metal manipulation can be affected by the flow rate (0.05~0.2 mL/min), voltage (0~7 kV), and distance (15 and 30 mm) between electrodes, which changes the volume of the electric field-induced generated liquid metal droplet and the number of the generated droplets. When the electric field intensity increases or the flow rate increases, the generated droplet volume decreases, and the number of droplets increases. With the highest voltage of 7 kV with 15 mm between electrodes at the 0.2 mL/min flow rate, the lowest volume and the largest number of the generated droplets for 10 s were ~10 nL and 541, respectively. Additionally, we controlled the direction of the generated droplet by changing the electric field. The direction of the liquid metal droplet was controlled with the maximum angle of ~12°. Moreover, we exhibited a short circuit demonstration by controlling the volume or falling direction of the generated liquid metal droplet with an applied electric field.

Influence of temperature dependent physical properties on liquid metal droplet impact dynamics

The dynamics of a metal droplet impacting on a substrate surface has been studied in the paper numerically. Numerical solutions of the Navier-Stokes and Energy equations show the evolution of the droplet as it spreads upon impact with the substrate while simultaneously undergoing solidification. The interplay of the different forces including inertia, viscous and surface tension, coupled with solidification of the molten material in layers lead to complex flow dynamics. The change in density and viscosity owing to change in temperature resulting from the cooling process, is found to influence the spreading of the droplet significantly. The model was exercised for three different materials viz. aluminium, copper and nickel to determine the final splat radius as well as spreading time. The surface tension forces as well as solidification rates were found to be the dominant factors in determining the above parameters as well as the shape of the splat during spreading. The results were found to be in good agreement with existing analytical model.

Pinhole Formation in Printed Electronic Traces Fabricated via Molten Metal Droplet Jetting

The fabrication of printed electronic devices via molten metal droplet jetting has enormous potential in flexible electronic device applications due to the extremely high electrical conductivity and excellent substrate adhesion of printed features. However, large pinholes (which could be detrimental to the feature performance) have been experimentally observed when molten metal droplets of aluminum 4043 alloy are deposited and solidified on a polyimide (PI) substrate. In this study, we have shown that subjecting the polymer substrate to elevated temperature during droplet deposition considerably reduces the number and size of pinholes. The formation mechanism behind the large pinholes is interpreted as the release of the adsorbed/absorbed moisture from the polymer substrate into the solidifying droplet due to the rapid rise in temperature of the substrate upon droplet impact. Through numerical modelling, we have shown that the temperature of the polyimide substrate underneath the deposited droplet exceeds the boiling point of water while the metal droplet is still in liquid state, showing the possibility of water vapor escaping from the substrate and causing pinholes in the solidifying metal.

Investigation of dimensional accuracy of metal droplet deposition under repulsion using a lattice Boltzmann approach

Purpose This paper aims to investigate the influence of droplet infiltration and sliding on the deposition size and make a uniform deposition by controlling the interaction between droplets, using the three-dimensional lattice Boltzmann method (LBM) based on the actual working condition. Design/methodology/approach D3Q19 Shan-Chen LB approach is developed and optimized based on the metal droplet deposition. The Carnahan-Starling equation of state and transition layers are introduced to maintain the greater stability and low pseudo velocities. In addition, an additional collision term is adopted to implement immersed moving boundary scheme to deal with no-slip boundaries on the front of the phase change. Findings The numerical results show that the new¬ incoming droplet wet and slide off the solidified surface and the rejection between droplets are the reasons for the deviation of the actual deposition length. The total length of the longitudinal section negatively correlates with the deposition distance. To improve the dimensional accuracy, the deposition distance and repulsion rate need to be guaranteed. The optimal deposition distance is found to have a negative linear correlation with wettability. Originality/value The numerical model developed in this paper will help predict the continuous metal droplet deposition and provide guidance for the selection of deposition distance.