Laser Scribing of Fluorinated Polyimide Films to Generate Microporous Structures for High-Performance Micro-supercapacitor Electrodes

Author(s):  
Minsu Kim ◽  
Min Guk Gu ◽  
Heeyoung Jeong ◽  
Eunseok Song ◽  
Jun Woo Jeon ◽  
...  

2012 ◽  
Vol 116 (44) ◽  
pp. 23676-23681 ◽  
Author(s):  
Jun-Wei Zha ◽  
Hong-Juan Jia ◽  
Hai-Yan Wang ◽  
Zhi-Min Dang


Polymer ◽  
2019 ◽  
Vol 173 ◽  
pp. 66-79 ◽  
Author(s):  
Dianrui Zhou ◽  
Lili Yuan ◽  
Weijie Hong ◽  
Haoyang Zhang ◽  
Aijun Hu ◽  
...  


RSC Advances ◽  
2015 ◽  
Vol 5 (93) ◽  
pp. 76476-76482 ◽  
Author(s):  
Zhenxun Huang ◽  
Shumei Liu ◽  
Yanchao Yuan ◽  
Jianqing Zhao

A simple strategy for preparing the low-κ FPI hybrids with enhanced properties.



1993 ◽  
Vol 304 ◽  
Author(s):  
Wayne E. Marsh ◽  
K. Kanakarajan ◽  
Garry D. Osborn

AbstractA family of new high performance thermoplastic polyimide adhesives have been developed that can be directly laminated to ceramic substrates, polyimide films, metals, and/or sputter metallized for eventual circuit fabrication. We have also developed new heat-sealable composite polyimide films that have improved CTE, that have good dimensional stability and that can also be directly bonded to ceramic and glass-ceramic substrates. With these new material sets various constructions of ceramic-polyimide rigid-flex systems can be conceived to meet the more demanding needs of the electronics industry. We have laminated these films to metals and various ceramic substrates such as alumina, aluminum nitride, glass, etc. and investigated the bond stabilities under thermal and humidity aging conditions.



Science ◽  
2012 ◽  
Vol 335 (6074) ◽  
pp. 1326-1330 ◽  
Author(s):  
M. F. El-Kady ◽  
V. Strong ◽  
S. Dubin ◽  
R. B. Kaner




1996 ◽  
Vol 14 (4) ◽  
pp. 2470-2474 ◽  
Author(s):  
Yasuko Yamada Maruo ◽  
Shigekuni Sasaki ◽  
Tsuneyuki Haga ◽  
Hiroo Kinoshita ◽  
Toshiyuki Horiuchi ◽  
...  


1995 ◽  
Vol 7 (3) ◽  
pp. 357-369 ◽  
Author(s):  
Tsutomu Takeichi ◽  
Noriko Miyaguchi ◽  
Rikio Yokota

Random and block copolyimides made of biphenyltetracarboxylic dianhydride (BPDA) and 3,3'-diaminodiphenylacetylene (intA), p-phenylenediamine (PDA), and 4,4'-oxydianiline (ODA) were prepared. Random copolyimides were prepared by adding BPDA into an N-methylpyrrolidone (NMP) solution of diamine mixtures, followed by thermal imidization. The ratio of PDA and intA or ODA was 7:3. Block copolyimides were prepared by the reaction of amine-terminated BPDA/PDA units and anhydride-terminated BPDA/intA (or ODA) units. The ratio of PDA and intA or ODA was also set at 7:3. For the polyimides containing internal acetylene units, exotherms appeared on DSC measurements starting from 320C, which shows that crosslinking is occurring. Cold-drawing of polyamide acid films gave polyimide films with a higher modulus. High-temperature treatment to induce crossblinking did not lower the high modulus afforded by the cold-drawing. Crosslinking afforded a higher Tr, and a higher modulus at higher temperatures. Laminate processing was performed at 400C with a pressure of 100kgcm"2. The copolyimides containing internal acetylene units gave laminate films whose interfaces are strongly bonded through the crosslinking reaction. It was confirmed that the laminate films maintained the high modulus afforded by crosslinking.



1994 ◽  
Vol 253 (1-2) ◽  
pp. 430-434 ◽  
Author(s):  
Li-Hsin Chang ◽  
Naresh C. Saha


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