Miniaturization, Triple-Line Effects, and Reactive Wetting of Microsolder Interfaces

2020 ◽  
Vol 12 (7) ◽  
pp. 8935-8943
Author(s):  
Samuel J. Griffiths ◽  
Patcharawee Jantimapornkij ◽  
Guido Schmitz
Keyword(s):  
Triple Line ◽  
Reactive Wetting

Wettability and Interfacial Characteristic of Sn-Ag-Cu Solder on Ni Substrates at Elevated Temperatures

2012 ◽  
Vol 554-556 ◽  
pp. 703-708
Author(s):  
Li Kun Zang ◽  
Zhang Fu Yuan Yuan ◽  
Hong Liang Yan ◽  
Xin Xue Li
Keyword(s):  
Integrated Circuits ◽  
Elevated Temperatures ◽  
Sessile Drop ◽  
Triple Line ◽  
Contact Angles ◽  
Sessile Drop Method ◽  
Reactive Wetting ◽  
Ni Substrate ◽  
Eds Analysis ◽  
Interfacial Characteristic

Wettability and interfacial characteristic of the Sn-3.0Ag-0.5Cu/Ni system are investigated by sessile drop method at the temperature range of 503~673K. The reactive wetting processes demonstrate that: contact angles between the solder and Ni substrate decrease as exponential decay and the equilibrium contact angles decrease monotonously with the temperature increasing. Triple-line mobility is enhanced as the temperature increases. Interface of the Sn-3.0Ag-0.5Cu /Ni interface are identified by EPMA and EDS analysis as (Cu,Ni)6Sn5 adjacent to the solder and Ni3Sn4 adjacent to the Ni substrate, respectively. Cu is condensed at the interface, the composition of (Cu,Ni)6Sn5 is (23.16~23.46)Ni- (36.56~37.52) Cu-(39.02~40.27)Sn (atom %). The formation of the (Cu,Ni)6Sn5 IMC was known to greatly improve the reliability of the solder joints in integrated circuits.

scholarly journals Wetting of Laser Textured Cu Surface by Ethylene Glycol and Sn

2021 ◽  
Vol 4 (1) ◽  
Author(s):  
Kaibin Xie ◽  
Yujie Ge ◽  
Qiaoli Lin
Keyword(s):  
Surface Roughness ◽  
Ethylene Glycol ◽  
Sessile Drop ◽  
Early Stage ◽  
Triple Line ◽  
Nanosecond Laser ◽  
Quasi Equilibrium ◽  
Reactive Wetting ◽  
Artificial Roughness ◽  
Interfacial Evolution

The effect of microcosmic morphologies of textured Cu surface by nanosecond laser on the inert wetting and reactive wetting, i.e., ethylene glycol/copper and tin/copper wetting systems, was studied by using modified sessile drop methods. To create different surface roughness, the microcosmic morphologies with different spacing of grooves were constructed by nanosecond laser. The results showed that the inert wetting (ethylene glycol/copper) was consistent with Wenzel model, while the reactive wetting results deviated from the model. In Sn/Cu reactive wetting system, the interfacial evolution in the early stage and the pinning of triple line by the precipitated h-Cu6Sn5 caused the rougher surface and the worse final wettability. When the scale of artificial roughness exceeded the roughness that was caused by interfacial reaction after reaching the quasi-equilibrium state at interface, the final wettability could be improved.

Can Ising model and/or QKPZ equation properly describe reactive-wetting interface dynamics?

Open Physics ◽  
2009 ◽  
Vol 7 (3) ◽  
Author(s):  
Yael Efraim ◽  
Haim Taitelbaum
Keyword(s):  
Liquid Droplet ◽  
High Sensitivity ◽  
Triple Line ◽  
Linear Process ◽  
Growth Exponent ◽  
Full Description ◽  
Reactive Wetting ◽  
Microscopic Mechanism ◽  
Interface Dynamics ◽  
Wetting Process

AbstractThe reactive-wetting process, e.g. spreading of a liquid droplet on a reactive substrate is known as a complex, non-linear process with high sensitivity to minor fluctuations. The dynamics and geometry of the interface (triple line) between the materials is supposed to shed light on the main mechanisms of the process. We recently studied a room temperature reactive-wetting system of a small (∼ 150 μm) Hg droplet that spreads on a thin (∼ 4000 Å) Ag substrate. We calculated the kinetic roughening exponents (growth and roughness), as well as the persistence exponent of points on the advancing interface.In this paper we address the question whether there exists a well-defined model to describe the interface dynamics of this system, by performing two sets of numerical simulations. The first one is a simulation of an interface propagating according to the QKPZ equation, and the second one is a landscape of an Ising chain with ferromagnetic interactions in zero temperature.We show that none of these models gives a full description of the dynamics of the experimental reactivewetting system, but each one of them has certain common growth properties with it. We conjecture that this results from a microscopic behavior different from the macroscopic one. The microscopic mechanism, reflected by the persistence exponent, resembles the Ising behavior, while in the macroscopic scale, exemplified by the growth exponent, the dynamics looks more like the QKPZ dynamics.

Diffusion-limited reactive wetting: effect of interfacial reaction behind the advancing triple line

2007 ◽  
Vol 42 (19) ◽  
pp. 8071-8082 ◽  
Author(s):  
F. Hodaj ◽  
O. Dezellus ◽  
J. N. Barbier ◽  
A. Mortensen ◽  
N. Eustathopoulos
Keyword(s):  
Interfacial Reaction ◽  
Triple Line ◽  
Reactive Wetting ◽  
Diffusion Limited

Modelling Kinetics of Diffusion Controlled Reactive Wetting: The Role of Reaction behind the Triple Line

2000 ◽  
Vol 72 ◽  
pp. 91-98
Author(s):  
F. Hodaj ◽  
J.N. Barbier ◽  
Andreas Mortensen ◽  
Olivier Dezellus ◽  
N. Eustathopoulos
Keyword(s):  
Triple Line ◽  
Reactive Wetting ◽  
Diffusion Controlled ◽  
Kinetics Of

MECHANISMS OF REACTIVE WETTING: THE QUESTION OF TRIPLE LINE CONFIGURATION

1997 ◽  
Vol 45 (7) ◽  
pp. 3079-3085 ◽  
Author(s):  
K LANDRY ◽  
C RADO ◽  
R VOITOVICH ◽  
N EUSTATHOPOULOS
Keyword(s):  
Triple Line ◽  
Reactive Wetting ◽  
Line Configuration

Reactive Wetting Processes and Triple-Line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures

2012 ◽  
Vol 41 (8) ◽  
pp. 2051-2056 ◽  
Author(s):  
Likun Zang ◽  
Zhangfu Yuan ◽  
Zhanmin Cao ◽  
Hiroyuki Matsuura ◽  
Fumitaka Tsukihashi
Keyword(s):  
Elevated Temperatures ◽  
Triple Line ◽  
Reactive Wetting ◽  
Line Configuration ◽  
Cu Substrates

The Triple Line in Reactive Wetting

1998 ◽  
Vol 38 (8) ◽  
pp. 1225-1228 ◽  
Author(s):  
F.G Yost
Keyword(s):  
Triple Line ◽  
Reactive Wetting

Wetting Behavior and Interfacial Characteristic of the Sn-3.5Ag Alloy on Ni Substrates

2013 ◽  
Vol 834-836 ◽  
pp. 335-339
Author(s):  
Li Kun Zang ◽  
Hong Liang Yan ◽  
Zhang Fu Yuan ◽  
Li Ying Lu
Keyword(s):  
Integrated Circuits ◽  
Sessile Drop ◽  
Triple Line ◽  
Contact Angles ◽  
Sessile Drop Method ◽  
Reactive Wetting ◽  
Wetting Behavior ◽  
Ni Substrate ◽  
Eds Analysis ◽  
Interfacial Characteristic

Wetting behavior and interfacial characteristic of the Sn-3.5Ag/Ni system are investigated by sessile drop method at the temperature range of 523~773K. The reactive wetting processes demonstrate that: contact angles between the solder and Ni substrate decrease as exponential decay and the equilibrium contact angles decrease monotonously with the temperature increasing. Triple-line mobility is enhanced as the temperature increases. Compositions of the Sn-3.5Ag/Ni interface are identified by EPMA and EDS analysis as Ni3Sn4adjacent to the solder and Ni3Sn adjacent to the Ni substrate, respectively. The formation of the interface IMC was known to greatly improve the reliability of the solder joints in integrated circuits.

TRIPLE LINE DISCLINATIONS

1990 ◽  
Vol 51 (C1) ◽  
pp. C1-95-C1-96 ◽  
Author(s):  
W. BOLLMANN
Keyword(s):  
Triple Line
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