Pteropods counter mechanical damage and dissolution through extensive shell repair

Abstract The paper presents the results of a study of the use of electro-separation methods for improvement of the utility value of 5 winter rapeseed cultivars. The process of electro-separation of rapeseed was conducted on a prototype apparatus built at the Laboratory of Application of Electro-technologies in Agriculture, Lviv National Agriculture University. The process facilitated separation of damaged, low quality seeds from the sowing material. The initial mean level of mechanically damaged seeds in the winter rapeseed cultivars studied varied within the range of 15.8-20.1%. Verification of the amount of seeds with mechanical damage was performed on X-ray images of seeds acquired by means of a digital X-ray apparatus. In the course of analysis of the X-ray images, it was noted that the mean level of mechanical damage to the seeds after the electro-separation was in the range of 2.1-3.8%. The application of the method of separation of rapeseeds in the corona discharge field yielded a significant reduction of the level of seeds with mechanical damage. The application of the method in practice may effectively contribute to improvement of the utility value of sowing material or seed material for production of edible oil.

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Diseases of the kumara crop

New Zealand Plant Protection ◽

10.30843/nzpp.2009.62.4845 ◽

2009 ◽

Vol 62 ◽

pp. 402-402

Author(s):

S.L. Lewthwaite ◽

P.J. Wright

Keyword(s):

Fungal Pathogens ◽

Ipomoea Batatas ◽

Mechanical Damage ◽

Soft Rot ◽

Economic Loss ◽

Root Surface ◽

Black Rot ◽

Rhizopus Stolonifer ◽

Ceratocystis Fimbriata ◽

Pink Rot

The predominant diseases of the commercial kumara (Ipomoea batatas) or sweetpotato crop are caused by fungal pathogens The field disease pink rot results from infection by the fungus Sclerotinia sclerotiorum Lesions form on vines but may spread down stems to the roots The widespread nature of this disease in sweetpotato appears peculiar to New Zealand Scurf is a disease caused by Monilochaetes infuscans which occurs in the field but may proliferate amongst stored roots The disease causes a superficial discolouration of the root surface which is mainly cosmetic but can also increase root water loss in storage Infection by Ceratocystis fimbriata produces a disease known as black rot The disease can be transmitted amongst plants at propagation but is particularly rampant amongst roots in storage This disease is readily transmitted and can cause severe economic loss Fusarium oxysporum causes surface rots in stored roots characterised by light to dark brown lesions that tend to be firm dry and superficial The lesions may be circular and centred on wounds caused by insects or mechanical damage at harvest Soft rot caused by Rhizopus stolonifer generally occurs in roots after they are washed and prepared for the market Fungal infection occurs through wounds or bruised tissue producing distinctive tufts of white fungal strands and black spores

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Effect of combine cylinder design on mechanical damage of corn

10.31274/rtd-180816-5486 ◽

1983 ◽

Author(s):

Nasser Abdulaziz Ajllan

Keyword(s):

Mechanical Damage

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WLCSP Laminate Removal Using NIR Laser

10.31399/asm.cp.istfa2018p0486 ◽

2018 ◽

Author(s):

Chun Haur Khoo

Keyword(s):

Near Infrared ◽

Laser Energy ◽

Photon Emission ◽

Mechanical Damage ◽

Consumer Products ◽

Fault Isolation ◽

Wafer Level ◽

Isolation Technique ◽

Laminate Layer ◽

Nir Laser

Abstract Driven by the cost reduction and miniaturization, Wafer Level Chip Scale Packaging (WLCSP) has experienced significant growth mainly driven by mobile consumer products. Depending on the customers or manufacturing needs, the bare silicon backside of the WLCSP may be covered with a backside laminate layer. In the failure analysis lab, in order to perform the die level backside fault isolation technique using Photon Emission Microscope (PEM) or Laser Signal Injection Microscope (LSIM), the backside laminate layer needs to be removed. Most of the time, this is done using the mechanical polishing method. This paper outlines the backside laminate removal method of WLCSP using a near infrared (NIR) laser that produces laser energy in the 1,064 nm range. This method significantly reduces the sample preparation time and also reduces the risk of mechanical damage as there is no application of mechanical force. This is an effective method for WLCSP mounted on a PCB board.

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An Alternative to High-Temperature and Acid/Solvent-Based Methods for Removing Integrated Circuits from Ceramic or Other Problem Substrates

ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2005p0489 ◽

2005 ◽

Author(s):

Carl M. Nail

Keyword(s):

High Temperature ◽

Integrated Circuits ◽

Success Rate ◽

Mechanical Damage ◽

Test Equipment ◽

High Success Rate ◽

Automated Test Equipment ◽

Removal Method ◽

Automated Test ◽

Conventional Methods

Abstract Dice must often be removed from their packages and reassembled into more suitable packages for them to be tested in automated test equipment (ATE). Removing bare dice from their substrates using conventional methods poses risks for chemical, thermal, and/or mechanical damage. A new removal method is offered using metallography-based and parallel polishing-based techniques to remove the substrate while exposing the die to minimized risk for damage. This method has been tested and found to have a high success rate once the techniques are learned.

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