Comparative study of structures, thermal stabilities and dielectric properties for a ferroelectric MOF [Sr(μ-BDC)(DMF)]∞ with its solvent-free framework

2013 ◽  
Vol 42 (18) ◽  
pp. 6603 ◽  
Author(s):  
Ping-Chun Guo ◽  
Zhenyu Chu ◽  
Xiao-Ming Ren ◽  
Wei-Hua Ning ◽  
Wanqin Jin
2012 ◽  
Vol 557-559 ◽  
pp. 1152-1156
Author(s):  
Yan Zhou ◽  
Fu Wei Huang ◽  
Fa Rong Huang ◽  
Lei Du

Modified silicon-containing arylacetylene resins (DMSEPE-OMPS) were prepared from poly(dimethylsilyleneethynylenephenyleneethynylene) (DMSEPE) and Octa(maleimidophenyl)- silsesquioxane (OMPS). The curing reaction of DMSEPE-OMPS resin was studied by FT-IR and DSC techniques. Thermal stability and dielectric properties of cured DMSEPE-OMPS resins were determined. FT-IR and DSC analyses indicate that thermal polymerization of DMSEPE-OMPS resin occurs in the curing process. Thermal stabilities of cured DMSEPE-OMPS resins under N2 and air atmosphere decrease gradually with the increment of OMPS components. The incorporation of OMPS can obviously reduce dielectric constant of DMSEPE-OMPS resins.


2005 ◽  
Vol 22 (2) ◽  
pp. 398 ◽  
Author(s):  
Mustapha Abarkan ◽  
Jean Paul Salvestrini ◽  
Denis Pelenc ◽  
Marc D. Fontana

2013 ◽  
Vol 34 (11) ◽  
pp. 112001 ◽  
Author(s):  
Safa'a M. Hraibat ◽  
Rushdi M-L. Kitaneh ◽  
Mohammad M. Abu- Samreh ◽  
Abdelkarim M. Saleh

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