The formation mechanism, improved photoluminescence and LED applications of red phosphor K2SiF6:Mn4+

2014 ◽  
Vol 2 (20) ◽  
pp. 3879-3884 ◽  
Author(s):  
Lifen Lv ◽  
Xianyu Jiang ◽  
Shaoming Huang ◽  
Xi'an Chen ◽  
Yuexiao Pan

The formation mechanism of red phosphor K2SiF6:Mn4+ free of manganese oxides has been discussed based on detailed experimental results. Significant improvements in the luminescence efficiency make it a good candidate for applications in “warm” white LEDs.

2015 ◽  
Vol 3 (9) ◽  
pp. 1935-1941 ◽  
Author(s):  
Lifen Lv ◽  
Zhen Chen ◽  
Guokui Liu ◽  
Shaoming Huang ◽  
Yuexiao Pan

The formation mechanism for red phosphors K2TiF6:Mn4+synthesized at room temperature has been discussed. The luminescence intensity has been improved by optimizing the synthetic process. Encapsulation of the red phosphor K2TiF6:Mn4+with YAG:Ce on a GaN layer produces “warm” white LEDs with color rendering 86 at 3251 K.


2016 ◽  
Vol 4 (12) ◽  
pp. 2374-2381 ◽  
Author(s):  
Hui Chen ◽  
Hang Lin ◽  
Qingming Huang ◽  
Feng Huang ◽  
Ju Xu ◽  
...  

This work highlights a novel double-perovskite red phosphor Gd2ZnTiO6:Mn4+for UV-based warm white LEDs.


2017 ◽  
Vol 100 (5) ◽  
pp. 2005-2015 ◽  
Author(s):  
Luqing Xi ◽  
Yuexiao Pan ◽  
Xian Chen ◽  
Shaoming Huang ◽  
Mingmei Wu
Keyword(s):  

2020 ◽  
Vol 13 (6) ◽  
pp. 5581-5592
Author(s):  
Yu Wang ◽  
Bin Deng ◽  
Yuee Ke ◽  
Shuang Shu ◽  
Rixin Liu ◽  
...  

2017 ◽  
Vol 34 (1) ◽  
pp. 40-44 ◽  
Author(s):  
Hao Zhang ◽  
Yang Liu ◽  
Fenglian Sun ◽  
Gaofang Ban ◽  
Jiajie Fan

Purpose This paper aimed to investigate the effects of nano-copper particles on the melting behaviors, wettability and defect formation mechanism of the Sn58Bi composite solder pastes. Design/methodology/approach In this paper, the mechanical stirring method was used to get the nano-composite solder pastes. Findings Experimental results indicated that the addition of 3 wt.% (weight percentage) 50 nm copper particles showed limited effects on the melting behaviors of the Sn58Bi composite solder paste. The spreading rate of the Sn58Bi composite solder paste showed a decreasing trend with the increase of the weight percentage of 50 nm copper particles from 0 to 3 wt.%. With the addition of copper particles of diameters 50 nm, 500 nm or 6.5 μm into the Sn58Bi solder paste, the porosities of the three types of solder pastes showed a similar trend. The porosity increased with the increase of the weight percentage of copper particles. Based on the experimental results, a model of the void formation mechanism was proposed. During reflow, the copper particles reacted with Sn in the matrix and formed intermetallic compounds, which gathered around the voids produced by the volatilization of flux. The exclusion of the voids was suppressed and eventually led to the formation of defects. Originality/value This study provides an optimized material for the second and third level packaging. A model of the void formation mechanism was proposed.


2019 ◽  
Vol 48 (4) ◽  
pp. 1376-1385 ◽  
Author(s):  
Feng Hong ◽  
Haiming Cheng ◽  
Chao Song ◽  
Guixia Liu ◽  
Wensheng Yu ◽  
...  

Red phosphors (NH4)2NaInF6:Mn4+ with controllable morphology were synthesized via different synthetic methods, which can be fabricated for warm white LEDs.


2019 ◽  
Vol 103 (3) ◽  
pp. 1773-1781 ◽  
Author(s):  
Xian Yang ◽  
Yu Zhang ◽  
Xuejie Zhang ◽  
Jian Chen ◽  
Haisen Huang ◽  
...  

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