Fast and feasible sample preparation methods for extraction of trace elements from deposited particulate matter samples

2017 ◽  
Vol 9 (3) ◽  
pp. 490-499 ◽  
Author(s):  
A. M. S. Mimura ◽  
C. C. M. Ferreira ◽  
J. C. J. Silva

In this study, two alternative sample preparation procedures are proposed, using ultrasound and microwave, for rapid, reliable and easy extraction of trace elements from particulate matter samples.

2014 ◽  
Vol 29 (4) ◽  
pp. 753-761 ◽  
Author(s):  
D. Salcedo ◽  
J. P. Bernal ◽  
O. Pérez-Arvizu ◽  
E. Lounejeva

A method was tested for the digestion of SRM 1648a and airborne particulate samples using acid reflux before ICP-MS analysis of trace elements. The suitability of SRM 1648(a) as a reference material for airborne PM is discussed.


2011 ◽  
Vol 26 (9) ◽  
pp. 1849 ◽  
Author(s):  
J. S. F. Pereira ◽  
C. L. Knorr ◽  
L. S. F. Pereira ◽  
D. P. Moraes ◽  
J. N. G. Paniz ◽  
...  

2020 ◽  
Vol 27 (17) ◽  
pp. 21914-21923 ◽  
Author(s):  
Jaime S. Mandlate ◽  
Bruno M. Soares ◽  
Carlos F. F. Andrade ◽  
Leonir A. Colling ◽  
Ednei G. Primel ◽  
...  

Planta Medica ◽  
2016 ◽  
Vol 82 (05) ◽  
Author(s):  
M Wilcox ◽  
M Jacyno ◽  
J Marcu ◽  
J Neal-Kababick

Author(s):  
Andrew J. Komrowski ◽  
N. S. Somcio ◽  
Daniel J. D. Sullivan ◽  
Charles R. Silvis ◽  
Luis Curiel ◽  
...  

Abstract The use of flip chip technology inside component packaging, so called flip chip in package (FCIP), is an increasingly common package type in the semiconductor industry because of high pin-counts, performance and reliability. Sample preparation methods and flows which enable physical failure analysis (PFA) of FCIP are thus in demand to characterize defects in die with these package types. As interconnect metallization schemes become more dense and complex, access to the backside silicon of a functional device also becomes important for fault isolation test purposes. To address these requirements, a detailed PFA flow is described which chronicles the sample preparation methods necessary to isolate a physical defect in the die of an organic-substrate FCIP.


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